Share : Packaging Trends – Portable Applications

robinson

Packaging Trends – Portable Applications
-----------------------------------------------------------------------------
IC packaging comprises the processes and methods for providing a satisfactory electrical, mechanical and thermal operating environment for an integrated circuit. The resulting "packaged" device is termed a module. The term multichip module (MCM) gained notoriety in the mid-1990s as a technology that incorporates several die on an interconnecting substrate. There was a flurry of activity to develop high-performance interconnecting substrates that could wring the utmost in performance from the bare, bumped or TAB die. Advanced packaging came to be viewed as a value-added process that offered the utmost performance with the smallest form factor (size and weight) for critical applications where cost was not the prime consideration. The resulting MCM developments gained a reputation as overpriced solutions good for solving niche problems only.