Weekly Report of Ray 20170608
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1. Current Progress and Accomplishment:
1.1. WF7T B0 ESD testing and FA:
1.1.1. Summary the ESD simulation result for HBM and MM. The ESD simulation to compare the B0 and C0 version for input pin voltage waveform during ESD stress events. The comparison shows significant improvement at C0 version, although the device model could not reflect real damage.
1.2. WF7T HT40_V2 layout:
1.2.1. Completed all the layout and verification. The IP package WF7T_RF_AFE_HT40_TOP_V2_20170608.tgz also ready.
1.3. WF7T B0 aQFN PCB:
1.3.1. 19 power boards are finished assembling and ship out.
1.3.2. RF boards assembling error for wrong component (se2614) sent by MOUSER. Changing in process and estimate ship out at next Tuesday.
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2. Major Issues for Attention:
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3. Key Action Plan for the Coming Week:
3.1. WF7T B0 PCB manufacturing and assembling
3.2. Power boards adjustment
3.3. aQFN RF boards verification and testing