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楼主: manfred

RF设计经典资料(很齐全的,从基本原理到单元电路)

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发表于 2010-4-9 23:32:00 | 显示全部楼层
闲下来看看
发表于 2010-6-5 16:56:08 | 显示全部楼层
学习学习
发表于 2010-6-5 16:59:57 | 显示全部楼层
看了,都是英文资料,图片也不完整,不是适合初学者的东东
发表于 2010-6-5 23:05:25 | 显示全部楼层
好东西,谢谢楼主!
发表于 2010-6-5 23:10:38 | 显示全部楼层
内容都不介绍一下??
发表于 2010-6-5 23:22:55 | 显示全部楼层
谢谢啦! 1# manfred
发表于 2010-10-10 13:18:27 | 显示全部楼层
在SEMI及会员公司的共同努力下,经过9个月的等待,美国联邦政府正式实施放宽刻蚀设备的出口条件,原来180nm的技术审核指标被正式放宽到了65nm。

After nearly nine months of waiting, the export control requirements for etch equipment and cluster tools have been reduced as a result of SEMI’s public policy work. Each year SEMI works closely with member companies to push for improvements to the export control list maintained by the multilateral Wassenaar Arrangement as part of their annual list review. The most recent proposals were agreed to in December 2009, but only implemented by the U.S federal government as of September 7, 2010.

Because of these newly implemented regulations, the control for etch equipment will no longer apply to equipment above 65 nanometers rather than the previous control level of 180 nanometers.  The control for cluster tools has been narrowed to only apply when two or more functionally different semiconductor process tools are used. Each of these new regulations is the result of several years of discussion between government and industry. They are good examples of the value of working together to improve the control list while reducing unnecessary burdens on exporters.

SEMI continues to be active in not only working on reforming the specific regulations that govern export control, but also working to ensure that our industry is given strong consideration as the federal government works to reform the overall the export control system.

For more information on export control issues, please contact Maggie Hershey at mhershey@semi.org.
发表于 2010-10-10 13:23:54 | 显示全部楼层
又花了25大洋
发表于 2010-10-11 01:34:04 | 显示全部楼层
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发表于 2010-10-11 01:38:03 | 显示全部楼层
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