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1、Job Title: dspSystem Engineer Department: Cellular Engineering Location: Shanghai
Job Description: Physical Layer System Engineer for 3G/GSM UE Marvell Shanghai is now looking for theTD-SCDMA, WCDMA, and GSM physical layer engineers to join us in 3G/2Gproduction. As a worldwide leading fabless semiconductor company, we areworking on 3G/2G communication product and technology. You would join in us inthe design, development, implementation and debug of advanced physical layerfirmware and system for the wireless communication productions.
Qualification: - A minimum of Bachelor degree in ElectricalEngineering is required with specialization in DSP or communication - Experience in the develop of the physicallayer or L1 Controller of 3G/2G (TD-SCDMA, WCDMA, GSM) are preferred - Related experience in the 3G/2G system design,Dual RAT, HSPA and system testing is a good plus - Strong Digital Signal Processing knowledge inthe area of digital communication system and of various digital modulationschemes - Good written and oral English skills - Good Team work
2、Job Title: DSP/Firmware Engineer Department:Cellular Engineering Location:Shanghai
JobDescription: -We arelooking for a DSP/Firmware Engineer with solid background in digitalcommunication and signal processing to join our system design team for wirelesscommunication system, include 2G/3G/4G. -Thesuccessful candidate is expected to work in a collaborative team oncutting-edge data communication technologies. Responsibility includes designingalgorithm and architecture and implementation for the physical layer of themodems. -Thisposition also requires close interaction with the digital design team on designspecification, verification and test.
Qualification: -M.S.orPh.D in Electrical Engineering -About 3yrs working experience. -Must havestrong knowledge of digital communication and signal processing theory -Proficientin building up communication system simulator with C/C++ and Matlab -Knowledgeand experience on the communication physical layer are preferred -Familiaritywith DSP and RTL implementation is a good plus. -Goodcommunication skills in spoken and written English -Good atcollaboration and team work
3、Job Title: DSP Engineer (TD/LTE) Department:Cellular Engineering Location:Shanghai
JobDescription: -We arelooking for a DSP/Firmware Engineer with solid background in digitalcommunication and signal processing to join our system design team for wirelesscommunication system, include 2G/3G/4G. -Thesuccessful candidate is expected to work in a collaborative team oncutting-edge data communication technologies. Responsibility includes designingalgorithm and architecture and implementation for the physical layer of themodems. -Thisposition also requires close interaction with the digital design team on designspecification, verification and test.
Qualification: -M.S.orPh.D in Electrical Engineering -About 3yrs working experience. -Must havestrong knowledge of digital communication and signal processing theory -Proficientin building up communication system simulator with C/C++ and Matlab -Knowledgeand experience on the communication physical layer are preferred -Familiaritywith DSP and RTL implementation is a good plus. -Goodcommunication skills in spoken and written English -Good atcollaboration and team work
4、Job Title: DSP/Firmware Audio Engineer Department:Cellular Engineering Location:Shanghai
JobDescription: -We arelooking for a Senior DSP/Firmware Engineer with solid background in audioprocessing to join our system design team for wireless communication system,include 2G/3G/4G -Helpcustomer do audio design related to the implementation with acoustic componentsand hardware circuit -Cooperatewith customer to definite and develop audio DSP block -Instructcustomer to implement audio tuning -Supportcustomer to analyze and solve audio related problems
Qualification: -B.Sc. inSignal & information Processing Engineering, Electronic Engineering,Telecommunication Engineering or other relevant major -At least 3years of relevant working experience with emphasis on audio DSP tuning,hardware circuit design -Familiarwith mobile phone test Standard -Familiarwith acoustic design of audio components -Familiarwith architecture application of one audio DSP processor -Have thebasic knowledge of signal process algorithm, such as echo cancellation and soon -Knowledgeand experience on the communication physical layer are preferred -Goodcommunication skills in spoken and written English -Good atcollaboration and team work
If you are interested in any one of the four positions, please send your resume to the following email address: jiangrr@marvell.com Subject of your email should be: School_Name_Applied position_Information source
Eg.SJTU_Zhang Peng _Data Analyst_BBS
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