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[招聘] 【Marvell Cellular手机部门】招聘DSP Engineer

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发表于 2014-12-24 14:47:19 | 显示全部楼层 |阅读模式

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1Job Title: dspSystem Engineer

Department: Cellular Engineering

Location: Shanghai


Job Description:

Physical Layer System Engineer for 3G/GSM UE

Marvell Shanghai is now looking for theTD-SCDMA, WCDMA, and GSM physical layer engineers to join us in 3G/2Gproduction. As a worldwide leading fabless semiconductor company, we areworking on 3G/2G communication product and technology. You would join in us inthe design, development, implementation and debug of advanced physical layerfirmware and system for the wireless communication productions.


Qualification:

- A minimum of Bachelor degree in ElectricalEngineering is required with specialization in DSP or communication

- Experience in the develop of the physicallayer or L1 Controller of 3G/2G (TD-SCDMA, WCDMA, GSM) are preferred

- Related experience in the 3G/2G system design,Dual RAT, HSPA and system testing is a good plus

- Strong Digital Signal Processing knowledge inthe area of digital communication system and of various digital modulationschemes

- Good written and oral English skills

- Good Team work




2Job Title: DSP/Firmware Engineer

Department:Cellular Engineering

Location:Shanghai


JobDescription:

-We arelooking for a DSP/Firmware Engineer with solid background in digitalcommunication and signal processing to join our system design team for wirelesscommunication system, include 2G/3G/4G.

-Thesuccessful candidate is expected to work in a collaborative team oncutting-edge data communication technologies. Responsibility includes designingalgorithm and architecture and implementation for the physical layer of themodems.

-Thisposition also requires close interaction with the digital design team on designspecification, verification and test.


Qualification:

-M.S.orPh.D in Electrical Engineering

-About 3yrs working experience.

-Must havestrong knowledge of digital communication and signal processing theory

-Proficientin building up communication system simulator with C/C++ and Matlab

-Knowledgeand experience on the communication physical layer are preferred

-Familiaritywith DSP and RTL implementation is a good plus.

-Goodcommunication skills in spoken and written English

-Good atcollaboration and team work



3Job Title: DSP Engineer (TD/LTE)

Department:Cellular Engineering

Location:Shanghai


JobDescription:

-We arelooking for a DSP/Firmware Engineer with solid background in digitalcommunication and signal processing to join our system design team for wirelesscommunication system, include 2G/3G/4G.

-Thesuccessful candidate is expected to work in a collaborative team oncutting-edge data communication technologies. Responsibility includes designingalgorithm and architecture and implementation for the physical layer of themodems.

-Thisposition also requires close interaction with the digital design team on designspecification, verification and test.


Qualification:

-M.S.orPh.D in Electrical Engineering

-About 3yrs working experience.

-Must havestrong knowledge of digital communication and signal processing theory

-Proficientin building up communication system simulator with C/C++ and Matlab

-Knowledgeand experience on the communication physical layer are preferred

-Familiaritywith DSP and RTL implementation is a good plus.

-Goodcommunication skills in spoken and written English

-Good atcollaboration and team work



4Job Title: DSP/Firmware Audio Engineer

Department:Cellular Engineering

Location:Shanghai


JobDescription:

-We arelooking for a Senior DSP/Firmware Engineer with solid background in audioprocessing to join our system design team for wireless communication system,include 2G/3G/4G

-Helpcustomer do audio design related to the implementation with acoustic componentsand hardware circuit

-Cooperatewith customer to definite and develop audio DSP block

-Instructcustomer to implement audio tuning

-Supportcustomer to analyze and solve audio related problems


Qualification:

-B.Sc. inSignal & information Processing Engineering, Electronic Engineering,Telecommunication Engineering or other relevant major

-At least 3years of relevant working experience with emphasis on audio DSP tuning,hardware circuit design

-Familiarwith mobile phone test Standard

-Familiarwith acoustic design of audio components

-Familiarwith architecture application of one audio DSP processor

-Have thebasic knowledge of signal process algorithm, such as echo cancellation and soon

-Knowledgeand experience on the communication physical layer are preferred

-Goodcommunication skills in spoken and written English

-Good atcollaboration and team work



If you are interested in any one of the four positions, please send your resume to the following email address:   jiangrr@marvell.com

Subject of your email should be: School_Name_Applied position_Information source
Eg.SJTU_Zhang Peng _Data Analyst_BBS



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