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1、Job Title: DSP System Engineer Department:Cellular Engineering Location:Shanghai/Nanjing
JobDescription: PhysicalLayer System Engineer for 3G/GSM UE MarvellShanghai is now looking for the TD-SCDMA, WCDMA, and GSM physical layerengineers to join us in 3G/2G production. As a worldwide leading fablesssemiconductor company, we are working on 3G/2G communication product andtechnology. You would join in us in the design, development, implementation anddebug of advanced physical layer firmware and system for the wirelesscommunication productions.
Qualification: - A minimumof Bachelor degree in Electrical Engineering is required with specialization inDSP or communication -Experience in the develop of the physical layer or L1 Controller of 3G/2G(TD-SCDMA, WCDMA, GSM) are preferred - Relatedexperience in the 3G/2G system design, Dual RAT, HSPA and system testing is agood plus - StrongDigital Signal Processing knowledge in the area of digital communication systemand of various digital modulation schemes - Goodwritten and oral English skills - Good Teamwork
2、Job Title: DSP/Firmware Engineer Department:Cellular Engineering Location:Shanghai/Nanjing
JobDescription: -We arelooking for a DSP/Firmware Engineer with solid background in digitalcommunication and signal processing to join our system design team for wirelesscommunication system, include 2G/3G/4G. -Thesuccessful candidate is expected to work in a collaborative team oncutting-edge data communication technologies. Responsibility includes designingalgorithm and architecture and implementation for the physical layer of themodems. -Thisposition also requires close interaction with the digital design team on designspecification, verification and test.
Qualification: -M.S.orPh.D in Electrical Engineering -About 3yrs working experience. -Must havestrong knowledge of digital communication and signal processing theory -Proficientin building up communication system simulator with C/C++ and Matlab -Knowledgeand experience on the communication physical layer are preferred -Familiaritywith DSP and RTL implementation is a good plus. -Goodcommunication skills in spoken and written English -Good atcollaboration and team work
3、Job Title: DSP Engineer (TD/LTE) Department:Cellular Engineering Location:Shanghai/Nanjing
JobDescription: -We arelooking for a DSP/Firmware Engineer with solid background in digital communicationand signal processing to join our system design team for wireless communicationsystem, include 2G/3G/4G. -Thesuccessful candidate is expected to work in a collaborative team oncutting-edge data communication technologies. Responsibility includes designingalgorithm and architecture and implementation for the physical layer of themodems. -Thisposition also requires close interaction with the digital design team on designspecification, verification and test.
Qualification: -M.S.orPh.D in Electrical Engineering -About 3yrs working experience. -Must havestrong knowledge of digital communication and signal processing theory -Proficientin building up communication system simulator with C/C++ and Matlab -Knowledgeand experience on the communication physical layer are preferred -Familiaritywith DSP and RTL implementation is a good plus. -Goodcommunication skills in spoken and written English -Good atcollaboration and team work
4、Job Title: DSP/Firmware Audio Engineer Department:Cellular Engineering Location:Shanghai/Nanjing
JobDescription: -We arelooking for a Senior DSP/Firmware Engineer with solid background in audioprocessing to join our system design team for wireless communication system,include 2G/3G/4G -Helpcustomer do audio design related to the implementation with acoustic componentsand hardware circuit -Cooperatewith customer to definite and develop audio DSP block -Instructcustomer to implement audio tuning -Supportcustomer to analyze and solve audio related problems
Qualification: -B.Sc. inSignal & information Processing Engineering, Electronic Engineering,Telecommunication Engineering or other relevant major -At least 3years of relevant working experience with emphasis on audio DSP tuning, hardwarecircuit design -Familiarwith mobile phone test Standard -Familiarwith acoustic design of audio components -Familiarwith architecture application of one audio DSP processor -Have thebasic knowledge of signal process algorithm, such as echo cancellation and soon -Knowledgeand experience on the communication physical layer are preferred -Goodcommunication skills in spoken and written English -Good atcollaboration and team work
If you are interested in any one of the four positions, please send your resume to the following email address: jiangrr@marvell.com Subject of your email should be: School_Name_Applied position_Information source
Eg.SJTU_Zhang Peng _Data Analyst_BBS
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发表于 2014-10-15 17:38:29
发表于 2014-10-16 11:52:41
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