ICC floorplan PAD问题

太阳桥下

正在做PR，读入TDF文件之后，create floorplan，出来的floorplan比我设计的尺寸要大，如下所示：There are 0 pads constrained by min IO spacing.
Warning: All pads/pins have location constraints; No error checking will be performed
Overlaps are possible
Top core spacing increased, pad limited.
Right core spacing increased, pad limited.

Running IO Placement Refinement...

IO Placement Refinement Completed Successfully.

Place pads/pins successfully
Pad Limited detected in Bottom/Top sides.
Enlarge core width to 4232 by 152
Pad Limited detected in Left/Right sides.
Enlarge core height to 4232 by 152
Core aspect ratio adjusted to 1.000
Core Utilization adjusted to 0.683
Pad limited detected. Try fixed die size floor plan ...
Start to create wire tracks ...
GRC reference (349600,349600), dimensions (2400, 2400)
Start to place pads/pins ...


但是我看layout上，pad离Corner还有好远的距离呢，求教怎么会出现这样的情况（我的原本尺寸设计为4080*4080）