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DRAM/SRAM IC质量和可靠性控制
内容主要包括：
- 晶圆、封装制造流程
- 产品设计流程
- 可靠性测试（如下）
Chapter 3 Product Reliability 32
3.1 Reliability Assurance 32
3.1.1 Product/Process Qualification 32
3.1.2 Qualification Test Method and Acceptance Criteria 37
3.1.3 Semiconductor Device Failure Region 44
3.1.4 Failure Rate Calculation 45
3.1.5 Philosophy of Reliability Monitor 51
3.1.6 Reliability Test Equipment 53
3.2 Device Related Test Data 58
3.3 Package Related Test Data 63
3.4 Lead-Free Package Roadmap 64
3.5 Process Average Testing (PAT), Statistical Yield Analysis (SYA)
And Junction Verification Test (JVT) 65
Chapter 4 Failure Analysis 71
4.1 Establishment of Failure Analysis (FA) Laboratory 71
4.1.1 Electrical Failure Analysis (EFA) Laboratory 71
4.1.2 Assembly Engineering and Chemical Laboratory 71
4.1.3 Physical Failure Analysis (PFA) Laboratory 71
4.2 Failure Analysis Function 72
4.3 Failure Analysis Flow 73
4.4 Failure Analysis Instruments 75 |
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eetop公众号
创芯大讲堂
创芯人才网
发表于 2013-8-15 16:05:55
