看ICC的文档,有这么一段话
By default, the command places bump cells on the left die edge in the North orientation,
bump cells on the top die edge in the East orientation, bump cells on the right edge in the
South orientation, and so on. To place all flip-chip bump cells in the same orientation, use
the -same_orientation option
我以为bump cell就是用来连接芯片内外的一小块金属,为什么这个东西还有方向(orientation)?小白一个,不太理解,烦请哪位大佬帮忙解答下
谢谢 |