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[资料] Stanford University EE311 Course training

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发表于 2011-6-7 15:56:20 | 显示全部楼层 |阅读模式

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本帖最后由 suk.qi 于 2011-6-7 17:05 编辑

part1\Part2 参照:【Stanford University EE311 Course PPT】

Prof. Krishna Saraswat from
Department of Electrical Engineering
Stanford University
Stanford, CA 94305
saraswat@stanford.edu
EE311
2010-01-26  15:17         2,558,385 04Apr23 Stanford class - Gate_Dielectric (EOT ~ 20% TOX, Id∝Q_V, Oxide degrading Mechanism).pdf
2010-01-26  15:20         4,655,395 04Apr23 Stanford class - Gate_Dielectric (SiO2 - SiON in NH3_N2O_NO, high~K).pdf
2010-01-26  14:30         2,061,515 04Apr23 Stanford class - IBM_Silicides_Mann.pdf
2010-01-26  14:29         2,318,494 04Apr23 Stanford class - Interconnection Silicides (same as polycides - salicides and metal gate).pdf
2010-01-26  14:32         4,167,067 04Apr23 Stanford class - Interconnections -Copper & Low K Dielectrics (low RC delay, good EM, T↓t↑Gsize↑rho↓u↑).pdf
2010-01-26  14:32         3,823,128 04Apr23 Stanford class - Interconnections -Copper & Low K Dielectrics.pdf
2010-01-26  14:39         2,281,859 04Apr23 Stanford class - Low Power CMOS Process Technology (SS-leak, SiON, μ-Strained Liner, Hybrid Orientation, Wf, BTB, Halo, MG, SOI, FinFET, k~2.4,Tcap).pdf
2010-01-26  14:30         3,770,604 04Apr23 Stanford class - Polycides, Salicides & Metal gate (segregation, diffusion and consumption).pdf
2010-01-26  14:28            60,367 04Apr23 Stanford class - Scaling trends forthe on-chip power modeling (Interconnection, Logic, Memory, Leakage and clock).pdf
2010-01-26  15:19         6,527,050 04Apr23 Stanford class - Trends (α-scaling, Nanoscale, High-k, DG-FinFET, Isolation, Backend 3-D).pdf
2010-01-26  14:28           146,127 04Apr23 Stanford class - TSUPREM4_Slides.pdf
2010-01-26  15:15            73,400 04Apr23 Stanford class - USING TSUPREM-IV IN SWEET HALL.pdf
2011-06-02  10:48         2,049,187 20110531_工艺_Integrated circuit isolation technologies.pdf
2011-06-02  11:21         5,872,403 20110531_技术_Future Devices (Heterostructure_DG MOSFET_Center Channel DG-FET, HEMT, I-MOS) - 3.pdf
Stanford Process (FEOL - BEOL).part3.rar (13.83 MB, 下载次数: 375 )
2011-06-02  11:21        10,421,107 20110531_技术_Future Devices (Organic FETs,Molecular FET, Schottky SD Nanotube FETs) - 2.pdf
2011-06-02  10:49         4,475,088 20110531_技术_Future Devices (UTPDSOI, Non Planar MOSFETs, GeMOS - u3900, Egmin -Ileak_high) - 1.pdf
2011-06-02  11:21         2,786,302 20110601_工艺_Interconnect Al (Mechanical properties, EM minimized@GB, Air-Gap).pdf
2011-06-02  11:22         2,751,613 20110601_工艺_Interconnect Low k (weak polarization - nonpolar low-dielectric, minimize the moisture, Porous Materials).pdf
2011-06-02  11:21         4,745,335 20110601_工艺_Interconnect Scaling (Multilayer, HF - Skin Effect, Delay, Resistivity, Thermal, Low-k).pdf
2011-06-02  11:21         5,162,860 20110601_工艺_Shallow Junctions Slides (OED_ORD_TED, I↑V↓,defect ED in POLY several times faster, PAI, Bandgap Engineering, cl0_d0).pdf
Stanford Process (FEOL - BEOL).part4.rar (9.19 MB, 下载次数: 227 )
 楼主| 发表于 2011-6-7 16:14:36 | 显示全部楼层

Stanford University EE311 Course PPT

本帖最后由 suk.qi 于 2011-6-7 16:22 编辑

Prof. Krishna Saraswat from
Department of Electrical Engineering
Stanford University
Stanford, CA 94305
saraswat@stanford.edu
EE311

2010-01-26  15:17         2,558,385 04Apr23 Stanford class - Gate_Dielectric (EOT ~ 20% TOX, Id∝Q_V, Oxide degrading Mechanism).pdf
2010-01-26  15:20         4,655,395 04Apr23 Stanford class - Gate_Dielectric (SiO2 - SiON in NH3_N2O_NO, high~K).pdf
2010-01-26  14:30         2,061,515 04Apr23 Stanford class - IBM_Silicides_Mann.pdf
2010-01-26  14:29         2,318,494 04Apr23 Stanford class - Interconnection Silicides (same as polycides - salicides and metal gate).pdf Stanford Process (FEOL - BEOL).part1.rar (13.83 MB, 下载次数: 321 )
2010-01-26  14:32         4,167,067 04Apr23 Stanford class - Interconnections -Copper & Low K Dielectrics (low RC delay, good EM, T↓t↑Gsize↑rho↓u↑).pdf
2010-01-26  14:32         3,823,128 04Apr23 Stanford class - Interconnections -Copper & Low K Dielectrics.pdf
2010-01-26  14:39         2,281,859 04Apr23 Stanford class - Low Power CMOS Process Technology (SS-leak, SiON, μ-Strained Liner, Hybrid Orientation, Wf, BTB, Halo, MG, SOI, FinFET, k~2.4,Tcap).pdf
2010-01-26  14:30         3,770,604 04Apr23 Stanford class - Polycides, Salicides & Metal gate (segregation, diffusion and consumption).pdf Stanford Process (FEOL - BEOL).part2.rar (13.83 MB, 下载次数: 325 )
2010-01-26  14:28            60,367 04Apr23 Stanford class - Scaling trends forthe on-chip power modeling (Interconnection, Logic, Memory, Leakage and clock).pdf
2010-01-26  15:19         6,527,050 04Apr23 Stanford class - Trends (α-scaling, Nanoscale, High-k, DG-FinFET, Isolation, Backend 3-D).pdf
2010-01-26  14:28           146,127 04Apr23 Stanford class - TSUPREM4_Slides.pdf
2010-01-26  15:15            73,400 04Apr23 Stanford class - USING TSUPREM-IV IN SWEET HALL.pdf
2011-06-02  10:48         2,049,187 20110531_工艺_Integrated circuit isolation technologies.pdf
2011-06-02  11:21         5,872,403 20110531_技术_Future Devices (Heterostructure_DG MOSFET_Center Channel DG-FET, HEMT, I-MOS) - 3.pdf
2011-06-02  11:21        10,421,107 20110531_技术_Future Devices (Organic FETs,Molecular FET, Schottky SD Nanotube FETs) - 2.pdf
2011-06-02  10:49         4,475,088 20110531_技术_Future Devices (UTPDSOI, Non Planar MOSFETs, GeMOS - u3900, Egmin -Ileak_high) - 1.pdf
2011-06-02  11:21         2,786,302 20110601_工艺_Interconnect Al (Mechanical properties, EM minimized@GB, Air-Gap).pdf
2011-06-02  11:22         2,751,613 20110601_工艺_Interconnect Low k (weak polarization - nonpolar low-dielectric, minimize the moisture, Porous Materials).pdf
2011-06-02  11:21         4,745,335 20110601_工艺_Interconnect Scaling (Multilayer, HF - Skin Effect, Delay, Resistivity, Thermal, Low-k).pdf
2011-06-02  11:21         5,162,860 20110601_工艺_Shallow Junctions Slides (OED_ORD_TED, I↑V↓,defect ED in POLY several times faster, PAI, Bandgap Engineering, cl0_d0).pdf
 楼主| 发表于 2011-6-8 08:20:50 | 显示全部楼层
谢谢斑竹能仔细的看完并整理!向斑竹表示致意!
发表于 2011-7-10 20:08:41 | 显示全部楼层
感谢楼主分享,这个资料对于半导体器件的学习很有意义
发表于 2011-7-10 20:10:55 | 显示全部楼层
支持一下
发表于 2011-7-10 20:12:30 | 显示全部楼层
十分感谢!
发表于 2012-12-3 15:00:29 | 显示全部楼层
THX FOR SHARING~
发表于 2012-12-3 16:56:17 | 显示全部楼层
good,好东西
发表于 2014-8-1 16:39:50 | 显示全部楼层
excellent and dedication!
发表于 2014-8-1 17:57:58 | 显示全部楼层
谢谢楼主
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