Package-silicon co-design-experiment with an SOC design

drjiachen

Abstract
In this paper, we describe a package-silicon codesign
approach attempted for an RF integrated SOC
design. Extensive simulations were carried out to
determine the sensitivity of different package layout
parameters on signal integrity and noise related
issues. These experiments helped in influencing the
package layout design and the custom I/O cell design.
The I/O and core bump locations, and the package via
locations were determined based on the reliability and
noise considerations. Both the floorplanning and
package layout were fine tuned to optimize the area
and signal integrity issues. This was followed by
extensive package simulations to determine the SSN
and crosstalk numbers.

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