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Electronic Packaging and Interconnection Handbook 4/E
Charles Harper
ISBN: 9780071430487
Pages: 1000
Pub Date: OCT-04
Publish Status: In Stock
Copyright Year: 2005
Introduction | |
Electronic packaging is the underlying technology behind the creation of small electronic devices such as cell phones, PDAs, and laptops. Packaging advances in this field have driven the miniaturization of consumer electronics. This is THE standard reference in the field, nearly 75% rewritten to reflect the tremendous advances that have taken place in the past five years.
Contents: Fundamental Technologies; Materials for Electronic Packaging; Thermal Management of Electronic Packages; Shock,Vibration, and Operational Stress Management;Connector and Interconnections Technologies; Soldering and Cleaning Technologies * Packaging and Interconnection Technologies; Single Chips Packaging and Ball Grid Arrays; Surface Mount Technology; Hybrid and Multichip Module Packaging; Chip Scale, Flip Chip, and Direct Chip Attachment,Rigid and Flexible Printed Wiring Boards * System Packaging Technologies; Packaging High Speed and Microwave Systems; Packaging High Voltage Systems; Packaging of MEMs Systems; Packaging of Optoeletronic Systems
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Table of contents | |
CONTRIBUTORS
PREFACE
Chapter 1: Plastics, Elastomers, and Composites
Chapter 2: Adhesives, Underfills, and Coatings
Chapter 3: Thermal Management
Chapter 4: Connector and Interconnection Technology
Chapter 5: Solder Technologies for Electronic Packaging and Assembly
Chapter 6: Packaging and Interconnection of Integrated Circuits
Chapter 7: Hybrid Microelectronics and Multichip Modules
Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX
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