|
马上注册,结交更多好友,享用更多功能,让你轻松玩转社区。
您需要 登录 才可以下载或查看,没有账号?注册
x
semiconductor memories technology, testing, and reliability
Ashok K. Sharma
Semiconductor Memories provides in-depth coverage in the areas of design for testing, fault tolerance, failure modes and mechanisms, and screening and qualification methods including.
* Memory cell structures and fabrication technologies.
* Application-specific memories and architectures.
* Memory design, fault modeling and test algorithms, limitations, and trade-offs.
* Space environment, radiation hardening process and design techniques, and radiation testing.
* Memory stacks and multichip modules for gigabyte storage.
Preface. Chapter 1: Introduction. Chapter 2: Random Access Memory Technologies. 2.1 Introduction. 2.2 Static Random Access Memories (SRAMs). 2.3 Dynamic Random Access Memories (DRAMs). Chapter 3: Nonvolatile Memories. 3.1 Introduction. 3.2 Masked Read-Only Memories (ROMs). 3.3 Programmable Read-Only Memories (PROMs). 3.4 Erasable (UV)-Programmable Read-Only Memories (EPROMs). 3.5 Electrically Erasable PROMs (EEPROMs). 3.6 Flash Memories (EPROMs or EEPROMs). Chapter 4: Memory Fault Modeling and Testing. 4.1 Introduction . . . . 4.2 RAM Fault Modeling. 4.3 RAM Electrical Testing. 4.4 RAM Pseudorandom Testing. 4.5 Megabit DRAM Testing. 4.6 Nonvolatile Memory Modeling and Testing. 4.7 IDDQ Fault Modeling and Testing. 4.8 Application Specific Memory Testing. Chapter 5: Memory Design for Testability and Fault Tolerance. 5.1 General Design for Testability Techniques. 5.2 RAM Built-in Self-Test (BIST). 5.3 Embedded Memory DFT and BIST Techniques. 5.4 Advanced BIST and Built-in Self-Repair Architectures. 5.5 DFT and BIST for ROMs. 5.6 Memory Error-Detection and Correction Techniques. 5.7 Memory Fault-Tolerance Designs. Chapter 6: Semiconductor Memory Reliability. 6.1 General Reliability Issues. 6.2 RAM Failure Modes and Mechanisms. 6.3 Nonvolatile Memory Reliability. 6.4 Reliability Modeling and Failure Rate Prediction. 6.5 Design for Reliability. 6.6 Reliability Test Structures. 6.7 Reliability Screening and Qualification. Chapter 7: Semiconductor Memory Radiation Effects. 7.1 Introduction. 7.2 Radiation Effects. 7.3 Radiation-Hardening Techniques. 7.4 Radiation Hardness Assurance and Testing. Chapter 8: Advanced Memory Technologies. 8.1 Introduction. 8.2 Ferroelectric Random Access Memories (FRAMs). 8.3 Gallium Arsenide (GaAs) FRAMs. 8.4 Analog Memories. 8.5 Magnetoresistive Random Access Memories (MRAMs). 8.6 Experimental Memory Devices. Chapter 9: High-Density Memory Packaging Technologies. 9.1 Introduction. 9.2 Memory Hybrids and MCMs (2-D). 9.3 Memory Stacks and MCMs (3-D). 9.4 Memory MCM Testing and Reliability Issues. 9.5 Memory Cards. 9.6 High-Density Memory Packaging Future Directions. Index.
[ 本帖最后由 chaogao 于 2009-8-5 09:17 编辑 ] |
|