Springer 2008新书，Wafer Level 3-D ICs Process Technology

lotusky · 发表于 2009-7-1 21:52:59

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[size=120%]Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
By Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif

Publisher: Springer
Number Of Pages: 410
Publication Date: 2008-09-19
ISBN-10 / ASIN: 0387765328
ISBN-13 / EAN: 9780387765327

Product Description:

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging.
This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

nathanee · 发表于 2009-7-1 23:22:27

:victory: :victory:

ulsi123 · 发表于 2009-7-2 01:29:43

yunque · 发表于 2009-7-2 08:49:09

没抢到沙发啊！
非常谢谢楼主！

Jason_ke · 发表于 2009-7-2 10:33:56

好东西！

eagle_rabbit · 发表于 2009-7-2 16:15:03

thanks a lot for sharing

eagle_rabbit · 发表于 2009-7-2 16:16:19

好东西！

s2618017 · 发表于 2009-7-3 11:38:57

正在學習中~~
樓主謝謝你!!

lishyg · 发表于 2009-8-3 21:01:48

非常感谢分享！！！

lishyg · 发表于 2009-8-3 21:07:18

已经下载，非常感谢！！！

Springer 2008新书，Wafer Level 3-D ICs Process Technology

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