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《DESIGN FOR RELIABILITY》
EDITED BY
DANA CROWE & ALEC FEINBERG
章节:
Section I: The Stage Gate Process
Authors: Dana Crowe & Alec Feinberg
1. Reliability Science
1.1 Introduction
1.2 Reliability Design: “A Stage Gate Approach”
1.3 Design for Reliability Tools
1.4 Reliability Verification
1.5 Analytical Physics
1.6 The Goal Is Customer Satisfaction
2. Understanding Customer Requirements
2.1 Introduction
2.2 Specified and Unspecified Requirements
2.3 Cost of Reliability
2.4 Benchmarking
2.5 Using Failure Modes and Effects Analysis
to Meet Customer Requirements
3. Design Assessment Reliability Testing
3.1 Introduction
3.2 Four-Corner HALT Testing
3.3 Design Assessment Reliability Testing
at the Hybrid and Component Level
3.4 Summary
4. Design Maturity Testing (DMT)
4.1 Introduction
4.2 Overview of DMT Planning
4.3 DMT Reliability Objectives
4.4 DMT Methods
4.5 Reliability and Sampling Distribution Models
4.6 Sample Size Planning
4.7 Automated Accelerated Test Planning
4.8 DMT Methodology and Guidelines
References
5. Screening and Monotoring
5.1 Introduction
5.2 Achieving Reliability Growth in a Screening Program
5.3 Monitoring and Screening Tools
5.4 Highly Accelerated Stress Screening (HASS)
Section II: Supporting Stage Gate
Authors: Carl Bunis & Peter Ersland
6. Semiconductor Process Reliability
6.1 Introduction
6.2 Overview of Semiconductor Process Reliability Studies
in the GaAs Industry
6.3Wafer Level Reliability Tests
6.4 Summary
References
7. Analytical Physics
7.1 Introduction
7.2 Physics of Failure
7.3 Analysis Flow
7.4 Failure Analysis Example
7.5 Analytical Techniques
References
Section III: Topics in Reliability
Authors: Dana Crowe & Alec Feinberg
8. Reliability Statistics Simplified
8.1 Introduction
8.2 Definitions and Reliability Mathematics
8.3 Failure Rate Concepts
8.4 Reliability Models
8.5 Reliability Objectives and Confidence Testing
8.6 Parametric and Catastrophic Methods
8.7 Influence of Acceleration Factors on Test Planning
References
Appendix A – AT&T and CommonWeibull Model Comparisons
Appendix B – Helpful Microsoft® Excel Functions
9. Concepts in Accelerated Testing
9.1 Introduction
9.2 Common Sense Guidelines for Preventing
Anomalous Accelerated Testing Failures
9.3 Time Acceleration Factor
9.4 Applications to Accelerated Testing
9.5 High-Temperature Operating Life Acceleration Model
9.6 Temperature-Humidity-Bias Acceleration Model
9.7 Temperature Cycle Acceleration Model
9.8 Vibration Acceleration Model
9.9 Electromigration Acceleration Model
9.10 Failure-Free Accelerated Test Planning
9.11 Step-Stress Testing
9.12 Describing Life Distributions as a Function of Stress
9.13 Summary
References
10. Accelerated Reliability Growth
10.1 Introduction
10.2 Estimating Benefits with Reliability Growth Fixes
10.3 Accelerated Reliability Growth Methodology
10.4 Applying Accelerated Reliability Growth Theory
10.5 Assessing Reliability Growth
10.6 Summary
References
Appendix – Accelerated Reliability Growth Stage Gate Model
11. Reliability Predictive Modeling
11.1 Introduction
11.2 System Reliability Modeling
11.3 Customer Expectations
11.4 Various Methods
11.5 Common Problems
References
Appendix A – Tabulated k of n System Effective Failure Rates
Appendix B – Redundancy Equation with and without Repair
Appendix C – Availability
12. Failure Modes and Effects Analysis
12.1 Failure Modes and Effects Analysis
12.2 FMEA Goal and Vision
12.3 FMEA Concepts
12.4 Types of FMEA Evaluations
12.5 Objectives
12.6 An FMEA Example
12.7 Implementation Methods
Appendix A – Guide to Assigning FMEA Key Criteria
Appendix B – FMEA Forms
13. Evaluating Product Risk
13.1 Introduction
13.2 Goals of a Risk Program
13.3 Managing Risks for Your Program
13.4 Four Steps to Risk Management
13.5 Guidelines for Risk Planning (Step 1)
13.6 Guidelines for Risk Assessment (Step 2)
13.7 Guidelines for Risk Analysis (Step 3)
13.8 Guidelines for Risk Handling (Step 4)
14. Thermodynamic Reliability Engineering
14.1 Thermodynamics and Reliability Engineering
14.2 The System and Its Environment
14.3 The Aging Process
14.4 Aging Due to Cyclic Force
14.5 Corrosion and Activation
14.6 Diffusion
14.7 Transistor Aging of Key Device Parameters
14.8 Understanding Logarithmic-in-Time Parametric Aging
Associated with Activated Processes
14.9 Summary
References |
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