[每日更新]2008高频功率半导体核心技术解析

ericchen228

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ysm

                               
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Table of ContentsIntroduction
General Economic Environment
Application Updates to the Report
Merchant Captive Forecasts
Wattage Forecasts
Package Style Forecasts
Design Type Forecasts
Application Forecasts
Communications Sub-Segment Forecasts
Computers Sub-Segment Forecasts
Industrial Sub-Segment Forecasts
Solid State Lighting (SSL) Sub-Segment Forecasts
Medical Sub-Segment Forecasts
Military/Aerospace Sub-Segment Forecasts
Consumer Sub-Segment Forecasts
Appendix A Forecast Methodology

ysm

http://www.eetop.cn/bbs/viewthread.php?tid=179970&extra=page%3D1&frombbs=1

ISPSD2009讲义http://www.ispsd09.com/short_course.html

• Cosmic Rays Failure in Power Devices"
• GaN Power Devices on a Si substrate
  
  
                                 
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• TCAD for Smart Power and Power Devices Technologies tcad.pdf (633.47 KB, 下载次数: 4 )
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• Advanced Power MOSFET for integrated DC-DC Converters warwick.pdf (616.14 KB, 下载次数: 2 )
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• Safe operating area considerations in power Ics
• Module Packages and Reliability
• IGBTs; concept, state-of-the art technologies, and derivatives igbt.pdf (547.27 KB, 下载次数: 3 )
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robinsuper

半导体核心技术解析，于2008年底面世的最新高频产品，速度超快，报告中包括对其核心技术的解析，其设计的各个细节都有一一罗列