[ebook]Three-dimensional Integrated Circuit Design

pipiw

[size=120%]Three-dimensional Integrated Circuit Design (Systems

                               
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on Silicon)
By Vasilis F. Pavlidis, Eby G. Friedman

• Publisher:   Morgan Kaufmann
• Number Of Pages:   304
• ISBN-10 / ASIN:   0123743435
• ISBN-13 / EAN:   9780123743435

Product Description:
With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.

Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to enhance dramatically chip performance and functionality, while reducing the distance among devices on a chip. They promise solutions to the current "interconnect bottleneck" challenges faced by IC designers. They also may facilitate the integration of heterogeneous materials, devices, and signals. However, before these advantages can be realized, key technology challenges of 3D ICs must be addressed.

This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of three-dimensional integrated circuits.

* Demonstrates how to overcome "Interconnect Bottleneck" with 3D Integrated Circuit Design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers.
* The FIRST book on 3D Integrated Circuit Design...provides up-to-date information that is otherwise difficult to find;
* Focuses on design issues key to the product development cyle...good design plays a major role in exploiting the implementation flexibilities offered in the third dimension;
* Provides broad coverage of 3D IC Design, including Interconnect Prediction Models, Thermal Management Techniques, and Timing Optimization...offers practical view of designing 3D circuits.

[ 本帖最后由 pipiw 于 2009-2-25 09:22 编辑 ]

xudeqiang

这么新的书都可以搞到,佩服!!

soochowren

楼主真乃牛人也，下载了先，

qman

Good Books !!!

qman

Good Reference Book.

sjxu007

eetopeetopeetopeetop

sjxu007

PC ArchitecturePC ArchitecturePC Architecture

liuzhieetop

bing131

呵呵，看看新书，3D的怎么回事

rachel0131