请教一个射频电路PCB layout的问题

linuxunion

最近在学习射频电路的设计,自己设计的一个最高1GHz左右的前置电路,查了些资料,关于接地的部分,看资料有些是直接采用走线方式,有的采用铺铜方式.
我设计的电路因为比较简单,采用双层板设计.不知接地用那种方式比较好呢?
是直接用走线将各个器件的接地脚连接起来,还是采用铺铜方式呀?

linuxunion

高手怎么都不出招呢?

开创

好好好

Edwardlg

futong lianjie

twenqing

gooooooooo

Eric82

I will suggest a "copper plane". For RF circuit, the grond is very important. Even a via will affact your peformance. I will assumed signal "via" to ground will not enough. You can put "via" model in you simulation. Or, you can use around 1nH as one via to ground. This is more importnant for PA design. The via will reduce several dB in your design. If you compare the DEMO borad from different chip or device provider, you will find the answer. It will be a lot of via and a soild ground plane in the DEMO circuit. Hope this helps.

xli

It would be better if you could have a one piece solid ground. DC signal takes the path with the smallest resistance; RF signal takes the path with the lowest impedance. The smaller the loop, the better.

eedo

覆铜要好一些，不过也要看具体情况。

yzwfzy

如果是接电源地，可以走线的，但是接射频，覆铜较好，射频阻抗最近接地原则。

terrywang

直接接GND好