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Berkeley--Introduction to MEMS Design(2007)

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发表于 2008-7-26 10:26:07 | 显示全部楼层 |阅读模式

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Berkeley--Introduction to MEMS Design 2007

Course Description:
Physics, fabrication, and design of micro-electromechanical systems (MEMS). Micro- and nano-fabrication processes, including silicon surface and bulk micromachining and non-silicon micromachining. Integration strategies and assembly processes. Microsensor and microactuator devices: electrostatic, piezoresistive, piezoelectric, thermal, magnetic transduction. Electronic position-sensing circuits and electrical and mechanical noise. CAD for MEMS. Design project is required.


Course Description:
In its most common definition, the field of microelectromechanical systems (or MEMS) encompasses
tiny (generally chip-scale) devices or systems capable of realizing functions not easily achievable
via transistor devices alone. Among the useful functions realized via MEMS are:
1) Sensing of various parameters that include inertial variables, such as acceleration and rotation rate;
other physical variables, such as pressure and temperature; chemicals, often gaseous or liquids;
biological species, such as DNA or cells; and a myriad of other sensing modes, e.g., radiation.
2) Control of physical variables, such as the direction of light (e.g., laser light), the direction of radiated
energy, the flow of fluids, the frequency content of signals, etc. …
3) Generation and/or delivery of useful physical quantities, such as ultra-stable frequencies, power,
ink, and drug doses, among many others.
Although useful, the above definition and functional list fall short of describing some of more fundamentally
important aspects of MEMS that allows this field to accomplish incredible things. In particular,
MEMS design and technology fundamentally offer the benefits of scaling in physical domains
beyond the electrical domain, to additionally include the mechanical, chemical, and biological domains.
We are all well aware of the benefits of scaling when applied to integrated circuits. Specifically, via
continued scaling of dimensions over the years, integrated circuit transistor technology has brought
about transistor-based circuits with faster speed, lower power consumption, and larger functional
complexity than ever before. All of these benefits have come about largely through sheer dimensional
scaling.

By scaling the features of devices that operate in other physical domains (e.g., mechanical), MEMS
technology offers the same scaling benefits of
1) Faster speed, as manifested by higher mechanical resonance frequencies, faster thermal time constants,
etc., as dimensions are scaled.
2) Lower power or energy consumption, as manifested by the smaller forces required to move tiny
mechanical elements, or the smaller thermal capacities and higher thermal isolations achievable
that lead to much smaller power consumptions required to maintain certain temperatures.
3) Higher functional complexity, in that integrated circuits of mechanical links and resonators, fluidic
channels and mixers, movable mirrors and gratings, etc., now become feasible with MEMS technology.

[ 本帖最后由 semico_ljj 于 2008-7-26 10:54 编辑 ]
 楼主| 发表于 2008-7-26 10:33:59 | 显示全部楼层

Lecture Notes:

Lecture Notes: (每个附件可以独立解压缩)  
Lecture 1
Course Overview / Definition and Incentives for MEMS
Lecture 2
Benefits of Scaling
Lecture 3
Oxidation & Film Deposition I
Lecture 4
Film Deposition II
Lecture 5
ALD Lithography
Lecture 6
Etching, I/I
Lecture 7
I/I, Diffusion
Lecture 8
Surface Micromachining
Lecture 9
Subsurface Micromachining II
Lecture 10
Bulk Micromachining
Lecture 11
Bulk Micromachining II
Lecture 12
Mechanics of Materials
Lecture 13
Material Properties
Lecture 14
Beam Bending
Lecture 15
Beam Combos
Lecture 16
Energy Methods
Lecture 17
Energy Methods II
Lecture 18
Equivalent Circuits & Energy Conserving Transducers
Lecture 19
Equivalent Circuits & Project
Lecture 20
Lossless Transducers
Lecture 21
Capacitive Transducers
Lecture 22
ke and Comb Drive
Lecture 23
Input Modeling & Gyros
Lecture 24
Output Sensing
Lecture 25
Sensing Circuits
Lecture 26
Integration & Noise
Lecture 27
Noise
Lecture 28
Minimum Detectable Signal (MDS)

[ 本帖最后由 semico_ljj 于 2008-7-26 10:40 编辑 ]

mems1-2.rar

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 楼主| 发表于 2008-7-26 10:36:53 | 显示全部楼层
Lecture 3-10 ※※28

[ 本帖最后由 semico_ljj 于 2008-7-26 10:43 编辑 ]

mems3-6.rar

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mems7-9.rar

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mems10&28.rar

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 楼主| 发表于 2008-7-26 10:56:17 | 显示全部楼层
Lecture 11-14

[ 本帖最后由 semico_ljj 于 2008-7-26 11:00 编辑 ]

mems11.rar

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mems12.rar

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mems13-14.rar

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 楼主| 发表于 2008-7-26 11:04:31 | 显示全部楼层
lecture 15-20

[ 本帖最后由 semico_ljj 于 2008-7-26 11:07 编辑 ]

mems15-17.rar

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mems18-20.rar

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 楼主| 发表于 2008-7-26 11:11:18 | 显示全部楼层
lecture 21-27

[ 本帖最后由 semico_ljj 于 2008-7-26 11:16 编辑 ]

mems21-24.rar

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mems25-27.rar

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 楼主| 发表于 2008-7-26 11:12:07 | 显示全部楼层
Lecture Notes:
Lecture 1
Course Overview / Definition and Incentives for MEMS
Lecture 2
Benefits of Scaling
Lecture 3
Oxidation & Film Deposition I
Lecture 4
Film Deposition II
Lecture 5
ALD Lithography
Lecture 6
Etching, I/I
Lecture 7
I/I, Diffusion
Lecture 8
Surface Micromachining
Lecture 9
Subsurface Micromachining II
Lecture 10
Bulk Micromachining
Lecture 11
Bulk Micromachining II
Lecture 12
Mechanics of Materials
 楼主| 发表于 2008-7-26 11:13:47 | 显示全部楼层
Lecture 13
Material Properties
Lecture 14
Beam Bending
Lecture 15
Beam Combos
Lecture 16
Energy Methods
Lecture 17
Energy Methods II
Lecture 18
Equivalent Circuits & Energy Conserving Transducers
Lecture 19
Equivalent Circuits & Project
Lecture 20
Lossless Transducers
Lecture 21
Capacitive Transducers
Lecture 22
ke and Comb Drive
Lecture 23
Input Modeling & Gyros
Lecture 24
Output Sensing
Lecture 25
Sensing Circuits
Lecture 26
Integration & Noise
Lecture 27
Noise
Lecture 28
Minimum Detectable Signal (MDS)
 楼主| 发表于 2008-7-26 11:17:03 | 显示全部楼层
奈何奈何!
 楼主| 发表于 2008-7-30 18:19:10 | 显示全部楼层
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