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Title: Printed Circuits Handbook 5TH Edition
Edition: 5th Edition
Author: Coombs, Clyde F.
Publisher: McGraw-Hill Professional Publishing
Series: McGraw-Hill Handbooks
Publishing Date: August 2001
ISBN: 0071350160
Pages: 1200
Dimensions: 9.68x7.46x2.13 in. 4.76 lbs.
Price: US$125.00
Subject: Electronics - Circuits - Printed
Book Description
Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability, Coombs' PRINTED CIRCUITS HANDBOOK, Fifth Edition provides definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes. This new edition of the most trusted guide to pcbs gives you:
* Exhaustive coverage of HDI (High Density Interconnect) technologies including design, material, microvia fabrication, sequential lamination, assembly, testing, and reliability
* Coverage of fabrication developments including: blind and buried vias, controlled depth drilling, direct imaging, horizontal and pulse plating
* Thorough examination of base materials, including traditional and alternative laminates
* Understanding of effective quality and reliability programs, including: test & inspection, acceptability criteria, reliability of boards and assemblies, process capability and control
* Full treatment of multi-layer and flexible printed circuit design, fabrication and assembly advanced single- and multi-chip component packaging
* Contributions from pros at Motorola, Cisco, and other major companies
* Included CD-ROM, with the entire book in searchable format
* Hundreds of illustrations and instant-access tables, and formulas
Table of Contents
PART 1: INTRODUCTION TO PRINTED CIRCUITS
Chapter 1: Electronic Packaging and High-Density Interconnectivity
Chapter 2: Semiconductor Packaging Technology
Chapter 3: Advanced Packaging
Chapter 4: Types of Printed Wiring Boards
PART 2: MATERIALS
Chapter 5: Introduction to Base Materials
Chapter 6: Base Material Components
Chapter 7: Base Material Manufacturing Processes
Chapter 8: Properties of Base Materials
Chapter 9: Densification Issues for Base Materials
Chapter 10: Introducing Base Materials into the PCB Manufacturing Process
Chapter 11: HDI Microvia Materials
Chapter 12: Laminate Qualification and Testing
PART 3: ENGINEERING AND DESIGN
Chapter 13: Physical Characteristics of PCB
Chapter 14: The PCB Design Process
Chapter 15: Electrical and Mechanical Design Parameters
Chapter 16: Controlled Impedance
Chapter 17: Multilayer Design Issues
Chapter 18: Planning for Design, Fabrication, and Assembly
Chapter 19: Manufacturing Information Documentation and Transfer
Chapter 20: Electronic Contract Manufacturing Supplier Selection and Management
PART 4: HIGH-DENSITY INTERCONNECT
Chapter 21: Introduction to High-Density Interconnection Technology
Chapter 22: High-Density Interconnect-Build-up Technologies
Chapter 23: Microvia Hole Technologies
PART 5: FABRICATION PROCESSES
Chapter 24. Drilling Processes
Chapter 25. High-Density Interconnect Drilling
Chapter 26. Imaging
Chapter 27. Multilayer Materials and Processing
Chapter 28. Preparing Boards for Plating
Chapter 29. Electroplating
Chapter 30. Direct Plating
Chapter 31. PWB Manufacture Using Fully Electroless Copper
Chapter 32. Surface Finishes
Chapter 33. Etching Process and Technologies
Chapter 34. Solder Resist Material and Processes
Chapter 35. Machining and Routing
Chapter 36. Process Capability and Control
Chapter 37. Bare Board Test Objectives and Definitions
Chapter 38. Bare Board Test Methods
Chapter 39. Bare Board Test Equipment
Chapter 40. HDI Bare Board Special Testing Methods
PART 6: ASSEMBLY
Chapter 41. Assembly Processes
PART 7: SOLDERING
Chapter 42. Design for Soldering and Solderability
Chapter 43. Solder Materials and Processes
Chapter 44. No-Clean Assembly Process
Chapter 45. Lead-Free Soldering
Chapter 46. Fluxes and Cleaning
Chapter 47. Press-Fit Connections
PART 8: QUALITY CONTROL AND RELIABILITY
Chapter 48. Acceptability of Fabricated Boards
Chapter 49. Acceptability of Printed Circuit Board Assemblies
Chapter 50. Assembly Inspection
Chapter 51. Design for Testing
Chapter 52. Loaded Board Testing
Chapter 53. Reliability of Printed Circuit Assemblies
Chapter 54. Component-to-PWB Reliability
PART 9: ENVIRONMENTAL ISSUES AND WASTE TREATMENT
Chapter 55. Process Waste Minimization and Treatment
PART 10: FLEXIBLE CIRCUITS
Chapter 56. Flexible Circuits: Applications and Materials
Chapter 57. Design of Flexible Circuits
Chapter 58. Manufacturing of Flexible Circuits
Chapter 59. Termination of Flexible Circuits
Chapter 60. Special Constructions of Flexible Circuits
Chapter 61. Quality Assurance of Flexible Circuits
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发表于 2008-4-24 09:10:36
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