SI之Modeling of High-Speed Printed Circuit Board

drjiachen

Modeling of High-Speed Printed Circuit Board是一本国外论文
对高速电路设计有一定的帮助

Abstract ...................................................................................................... i
Acknowledgement ..................................................................................... iii
Table of Contents ...................................................................................... iv
List of figures, Listings and Tables ......................................................... viii
Chapter 1 On Modeling, Simulation and High Speed Printed Circuit Board Assembly 1
1.1 Introduction ......................................................................... 1
1.2 Modeling of PCB Assembly ............................................... 3
1.3 Structural Approach in PCB Assembly System Modeling .. 7
1.4 Scope of Thesis ................................................................... 9
Chapter 2 Derivation of Equivalent Circuit Models for Integrated Circuit Packaging and Discrete Components 13
2.1 Introduction ......................................................................... 13
2.2 Lumped Model of Integrated Circuit Package, Socket and Discrete Components ................................................... 14
2.2 Electromagnetic Field Solution Method ............................. 17
2.2.1 Capacitance, Inductance, Resistance and Conductance Matrices ............................................................................... 18
2.2.2 Finding the Elements of Capacitance and Inductance Matrices ................................................................................. 20
2.2.3 Finding the Resistance and Conductance Matrices ............. 23
2.3 Time Domain Reflectometry Method (TDR) ...................... 25
2.3.1 Inductive Load ..................................................................... 28
2.3.2 Capacitive Load ................................................................... 29
2.3.3 Coupled Inductance Measurement with TDR ..................... 29
2.3.4 Coupled Capacitance Measurement with TDR ................... 32
2.3.5 TDR Voltage Response of Complex Loads ......................... 33
2.4 Examples of Application ...................................................... 37
2.4.1 Modeling of Socket Using Electromagnetic Field Simulator .............................................................................. 37
2.4.2 Integrated Circuit Socket Characterization Using TDR ....... 39
2.4.3 Comparison of Results ......................................................... 43
2.4.4 Discrete Component Characterization ................................. 44
2.5 Creating a Socket or Packet Model ...................................... 45
2.5.1 Algorithm for Creating SPICE Netlist ................................. 46
2.5.2 Example of SPICE Netlist .................................................... 49
Chapter 3 Derivation of Equivalent Circuit Models for PCB trace discontinuities 52
3.1 Interconnection Discontinuity .............................................. 52
3.2 Analytical Based Method ..................................................... 54
3.3 Field Solution Method ......................................................... 55
3.3.1 Outline for Deriving Approximate Equilalent Model .......... 56
3.4 Time Domain Measurement Method ................................... 58
3.4.1 Impedance Profile ................................................................ 58
3.4.2 Deriving Approximate Model for Discontinuity ................. 62
3.5 Frequency Domain Measurement Method ........................... 64
3.6 Measurement Example and Validation of Models ............... 70
3.6.1 Validation of Models ........................................................... 70
3.6.2 Field Solution Method Modeling Example .......................... 71
3.6.3 TDR Modeling Examples ..................................................... 73
3.6.4 S-Parameters Measurement Modeling Example .................. 79
Chapter 4 Modeling of Single General Lossy Transmission Line 84
4.1 Introduction .......................................................................... 84
4.2 A.C. Dielectric Permittivity and Loss Tangent .................... 85
4.3 RLCG Circuit Parameters of Lossy Transmission Line ...... 87
4.3.1 Analysis for Metallic Loss ................................................... 89
4.3.2 Analysis for Dielectric Loss ................................................. 90
4.3.3 Summary of RLCG Parameters from Field Analysis ........... 91
4.4 The Attenuation Factor and Phase Factor of a Lossy Transmission Line ................................................................... 92
4.5 Circuit Elements Representation for Lossy Transmission Line ....................................................................................... 97
4.5.1 Simulation of Lossy Transmission Line ............................... 99
4.6 Simulation Example ............................................................. 104
4.6.1 Perfoming Numerical Convolution ...................................... 105
4.6.2 Comparison of Results ......................................................... 108
Chapter 5 Multiconductor Transmission Line 110
5.1 Introduction .......................................................................... 110
5.2 Wave Equation for Lossy Multiconductor Transmission Line ....................................................................................... 111
5.3 Modal Solution of Multiconductor Transmission Line ........ 114
5.4 Network Analysis and Simulation for Lossy Multiconductor Transmission Line ................................................................ 116
5.5 Lossless Multiconductor Transmission Line as a special case ....................................................................................... 124
5.5.1 Equivalent Circuit of Lossless Multiconductor Transmission Line ....................................................................................... 124
5.5.2 Homogeneous Dielectric Media ........................................... 126
5.5.3 Inhomogeneous Dielectric Media ........................................ 128
5.6 Determining the RLCG Matrices for Multiconductor Transmission Line ................................................................ 129
5.6.1 The Conductance Matrix ...................................................... 131
5.6.2 The Resistance Matrix ......................................................... 132
5.7 Simulation and Measurement Example ............................... 134
Chapter 6 Modeling of Power Distribution System in Printed Circuit Board 142
6.1 Introduction .......................................................................... 142
6.2 Power Distribution System in PCB - Power Planes ............. 142
6.3 Formulation .......................................................................... 144
6.4 Simulation Examples ............................................................ 153
6.5 Conclusions .......................................................................... 159
Chapter 7 System Modeling and Miscellaneous Items 161
7.1 Introduction .......................................................................... 161
7.2 Digital Integration Circuit I/O Buffer .................................. 161
7.2.1 Analog Behavioral Modeling (ABM) .................................. 162
7.2.2 Input/Output Buffer Information Specification (IBIS) ........ 162
7.2.3 Example of SPICE Netlist for ABM Model of Input and
Output Buffer ....................................................................... 166
7.3 Power supply ........................................................................ 168
7.4 System Modeling .................................................................. 170
7.5 System Simulation Example ................................................. 173
7.5.1 Time Domain Simulation Results ........................................ 174
7.5.2 Freqeuncy Domain Simulation Response ............................ 179
Chapter 8 Conclusions 182
Appendix A Partial Inductance ............................................................... 185
A.1 Introduction .......................................................................... 185
A.2 Analysis of Inductance in Multiconductor Environment ..... 185
A.3 Partial Inductance Definition Through Field Theory ........... 188
A.4 Partial Inductance Definition Through Energy
Consideration ........................................................................ 190
A.5 Summary ............................................................................... 192
References .................................................................................................... 193

drjiachen

Modeling of High-Speed Printed Circuit Board

[ 本帖最后由 drjiachen 于 2008-4-23 17:08 编辑 ]

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