Misconception and Mistake of electrostatic Protections

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Industrial Misconceptions of Grounding in ESD Controls  for Microelectronics

It has been widely adopted by electronics manufacturing industryies (including semiconductor Fab & Chip assembly, SMT, equipment assembly) that grounding could help eliminate the electrostatics of the materials and equipment in manufacturing processes. However, grounding is Meaningless to insulators to mitigate their electrostatics.
Regarding semiconductor manufacturing, grounding is Helpless to mitigate the electrostatics on insulating dielectric layers within semiconductor devices and quartz substrates of photomasks. Moreover, in several , grounding of wafer substrates and guard ring of photomask could not help reduce ESD failure rate but Increases. Such circumstances would be quite Ironic to ESD protections for semiconductors.
Industrial Technology Development on Electrostatic Protections for Microelectronics
Hot fields: SEMI manfuacturing and Flat Panel Display manufacturing,
In China, LEAN ESD Technology (Guangzhou) Co., Ltd innovated insulating stage of chuck for semiconductors and fistly introduced to Capacitive Touch Panel manufacturing in the year of 2018, and followingly extended to the module assembly productions line of FPD industry (including LCD and AMOLED).
While in USA, there is also several leading technology organizations to promote the correct use of grounding in semiconductor manufacturing since 2016, including LBL Scientific (Dr. Larry B Levit), Microtome (Dr. Gavin C Rider) and Simco-Ion system (Dr. Iad Mirsad).