Spring-2009-Solder Joint Reliability Prediction for Multiple Environments

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Solder Joint Reliability Prediction for Multiple Environments －－－ 综合环境中的焊点可靠性预测
2009 Solder Joint Reliability Prediction for Multiple Environments.pdf (4.06 MB, 下载次数: 52 )

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.




TABLE OF CONTENTS
Chapter 1. Introduction ................................................................................... 1
1.1. Book Layout ........................................................................................ 4
Chapter 2. Background.................................................................................... 7
2.1. CCGA and CBGA Electronic Packages .............................................. 7
2.2. CCGA Test Vehicle Description ......................................................... 9
2.3. Solder Material Behavior and Fatigue............................................... 11
2.4. Damage Parameters for Fatigue Prediction ....................................... 18
2.5. Solder Joint Fatigue Failure Prediction ............................................. 19
2.6. Cumulative Damage Prediction: Miner’s Rule.................................. 21
2.7. Laser Moiré Interferometry ............................................................... 22
2.8. Vibration Theory ............................................................................... 26
2.9. Chapter Summary.............................................................................. 36
Chapter 3. Literature Review........................................................................ 39
3.1. Thermal Cycling................................................................................ 39
3.2. Power Cycling ................................................................................... 42
3.3. Vibration Environment ...................................................................... 45
3.4. Multiple Combined or Sequential Environments .............................. 47
3.5. Pb-free Solder Joint Reliability ......................................................... 48
3.6. Chapter Summary.............................................................................. 58
Chapter 4. Unified Finite Element Modeling for Prediction of Solder Joint
Fatigue .......................................................................................... 65
4.1. Unified Finite Element Modeling Methodology ............................... 65
4.2. Choice of Material Models and Elements ......................................... 76
4.3. Compatibility of Element Types and Material Models ..................... 77
4.4. Calculation of Damage Parameter ..................................................... 78
4.5. Choice of Stress-free Temperature .................................................... 78
4.6. Chapter Summary.............................................................................. 80
Chapter 5. Validation of Unified FEM for Thermal Cycling and Power
Cycling Environments................................................................. 83
5.1. Laser Moiré Interferometry ............................................................... 83
5.2. Laser Moiré Studies on CCGA Package Assembly........................... 85
5.3. Laser Moiré Studies on CBGA Package Assembly........................... 91
5.4. FEM Accelerated Thermal Cycling Verification with Laser Moiré
Interferometry.................................................................................... 96
5.5. Importance of Including Creep in Every Solder Joint of FEM.......... 99
5.6. Power Cycling Verification............................................................... 99
5.7. Chapter Summary............................................................................ 101

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icroad

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AlexKe

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sydy110

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sydy110

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wonringking

谢谢分享 好书

sutaotao2001

Thanks