Electrical Design of Through Silicon Via 2014th Edition

amir98 · 发表于 2016-3-16 16:30:50

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本帖最后由 amir98 于 2016-3-16 23:59 编辑

Through Silicon Via the Design of Electrical 2014th Edition
by Manho Lee,(Editor),On Jun So Pak(Editor),Joungho Kim(Editor)

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Hardcover: 280 Pages
Publisher: Springer; Edition, 2014 (May 12,, 2014)
Language: English

RFplayer · 发表于 2016-3-16 17:33:17

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willywu · 发表于 2016-3-16 18:11:04

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willywu · 发表于 2016-3-16 18:14:19

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dcircuit · 发表于 2016-3-16 21:59:05

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