【FA】《Microelectronics Failure Analysis Desk Reference》6th edition 2011

kylinchan · 发表于 2025-9-11 14:16:04

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本帖最后由 kylinchan 于 2025-9-11 14:16 编辑

As the semiconductor industry moves from the “micro” to the “nano” realm, the Failure Analysis community needs to be pro-active in maintaining its ability to verify, isolate, uncover, and identify the root-cause of problems. These problems may be discovered in design debug, product or technology development and qualification, fabrication, packaging, reliability stress, or, most unfortunately, in the field. New materials and ever-shrinking technology dimensions make it increasingly more challenging for the failure analyst and make it increasingly important to provide analysis with information, training, equipment, and materials to enable them to cope with these challenges and opportunities.