Recent Advances and Trends in Advanced Packaging

flamingo123 · 发表于 2025-2-13 08:57:45

马上注册，结交更多好友，享用更多功能，让你轻松玩转社区。

您需要登录才可以下载或查看，没有账号？注册

x

Recent Advances And Trends In Advanced Packaging

(Lau) -- HI, interconnect density, electrical performance, bonding, 2.5D, 3D, chiplets, silicon bridges, advances ...
Speaker: Dr John H. Lau, Unimicron Technology

Summary: In this lecture semiconductor advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance and are grouped into 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, which will be presented and discussed. Key enabling technologies such as flip chip and fan-out will be briefly mentioned. The trends and challenges (opportunities) of advanced packaging will be discussed. Also, in this lecture, chiplet design and heterogeneous integration packaging are defined. The chiplet design and heterogeneous integration packaging such as those given by Xilinx, AMD, Intel, TSMC, and Samsung will be presented and discussed. The lateral communication between chiplets such as the silicon bridges embedded in organic build-up package substrate and fan-out epoxy molding compound as well as flexible bridges will be presented. Key enabling technologies such as thermocompression bonding and hybrid bonding will be briefly mentioned. The trends and challenges (opportunities) of chiplet design and heterogeneous integration packaging will be discussed.

Bio: John Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 510 peer-reviewed papers, 40 issued and pending U.S. patents, and 22 textbooks. He has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share. He has taught short courses at ECTC and other IEEE conferences.