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R3D is a resistive 3D extraction and analysis product for large resistive structures like power devices. Efficiency and reliability are key design criteria and R3D provides a solution to calculate and optimize both.
P2P provides fast, easy to use, full chip IR Drop, EM analysis, Point to Point Resistance analysis and Resistance Mapping. Problems are quickly highlighted in the graphical viewer, allowing fixes to be easily identified. Multiple modes of operation provide the user the necessary data to understand and correct problems:
– Resistance Mapping is the only tool available to show fully distributed resistance across the powernet – highlighting where problems originate
– Quickly understand the main contributors in Point to Point resistance problems
– Do fast What – if Analysis of IR Drop scenarios
ESRA provides full chip ESD analysis for Human Body Model (HBM), Machine Model (MM), and Charged Device Model (CDM) events. ESRA verifies that ESD design guidelines are met, highlights weak areas of designs, reports current density violations and high resistance paths. A graphical environment provides for debugging the violating paths.
F3D is a 3D capacitance and distributed RC extractor based on stochastic random walk method. F3D calculates capacitances from first principles using the original layout configuration, including all 3D and advanced manufacturing effects associated with 65nm, 45nm processes, and beyond.
HomePage: https://www.siliconfrontline.com/products/
Language: English
FileSize: 267 Mb
Operating Systems: RedHat Entrprise Linux 5.x-7.x
功能完美,联系3161633143@qq.com
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