找書: Advances in 3D Integrated Circuits and Systems

Capricorn0115 · 发表于 2023-3-10 00:42:08

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找書: Advances in 3D Integrated Circuits and Systems
作者 Hao Yu (Author), Chuan Seng Tan (Contributor)
Description

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Advances In 3D Integrated Circuits And Systems.jpg

Advances In 3D Integrated Circuits And Systems.jpg

yulizi · 发表于 2023-3-10 08:43:16

本帖最后由 yulizi 于 2023-3-10 08:46 编辑

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niuniu4 · 发表于 2023-3-10 09:01:09

谢谢分享！！！

niuniu4 · 发表于 2023-3-10 09:02:27

谢谢分享！！！！

Twonej · 发表于 2023-3-10 09:10:57

yulizi 发表于 2023-3-10 08:43

谢谢分享，找了一圈都是要几十刀乐的

liulongchao · 发表于 2023-3-10 09:18:46

yulizi 发表于 2023-3-10 08:43

thanks

tom0626 · 发表于 2023-3-10 09:52:58

Thank you very much.

amigo.change · 发表于 2023-3-10 11:54:38

Capricorn0115 · 发表于 2023-3-10 12:36:32

謝謝分享~

2502002036 · 发表于 2023-3-10 14:28:54

yulizi 发表于 2023-3-10 08:43

谢谢

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