台积电将向学术界开放16nmFinFET技术

芯华

帖子转自台积电官网

台積公司開放學界使用業界最成功的FinFET技術

台灣積體電路製造股份有限公司今（3）日宣佈推出大學FinFET專案，目的在於培育未來半導體晶片設計人才並推動全球學術創新。此專案開放大學院校師生與學術研究人員使用業界最成功的鰭式場效電晶體（FinFET）技術之製程設計套件(PDK)，將其晶片設計學習經驗提升至先進的16奈米FinFET技術，同時，此專案也提供大學院校領先的晶片研究人員使用16奈米(N16)及7奈米(N7)製程之多專案晶圓（Multi-Project Wafer，MPW）服務，將具有影響力的創新研究加速導入實際應用。

台積公司與亞洲、歐洲、及北美的服務夥伴攜手合作，提供大學院校以下資源以支援教學用途及測試晶片之研究專案：

• 以台積公司N16製程為主的教學用設計套件，包括教育設計案例、訓練資料、以及教學影片，引領學生從傳統平面式電晶體結構進入到FinFET世代。
• 針對具有影響力的研究專案，包括應用於邏輯、類比與射頻的研究設計，台積公司提供N16及N7製程設計相關套件，支援透過MPW服務生產的測試晶片。
  

台積公司業務開發資深副總經理張曉強博士表示：「台積公司向來著眼未來，無論是具有技術突破性的前瞻研究，或培育下一代創新者的未來人才。台積公司藉由提供大學FinFET專案開放我們的16奈米及7奈米技術，為研究人員及學生們開啟了全新舞台以探索各種想法，進而激發他們對令人振奮且快速成長的半導體領域的好奇心與熱情。」

作為業界最完備且充滿活力的設計生態系統，開放創新平台（Open Innovation Platform®）全力支援台積公司之技術與生產製造。台積公司設計生態系統服務夥伴已準備就緒和參與大學FinFET專案的學者建立聯繫，有興趣加入此專案的學術機構亦可透過以下網址聯繫當地的服務夥伴: https://www.tsmc.com/english/dedicatedFoundry/services/university_program。

HSINCHU, Taiwan, R.O.C., Feb. 3, 2023 – TSMC (TWSE: 2330, NYSE: TSM) today announced the launch of its “TSMC University FinFET Program”, aimed at developing future IC design talent for the industry and empowering academic innovation around the world. The program will provide broad educational access for university students, faculty, and academic researchers to the process design kit (PDK) of the industry’s most successful fin field-effect transistor (FinFET) technology at 16nm, bringing the IC design learning experience to the advanced FinFET level. The program will also provide access for leading IC researchers in universities to both 16nm (N16) and 7nm (N7) silicon through multi-project wafer (MPW) services to accelerate impactful research innovations towards real-world applications.

Working with service partners in Asia, Europe and North America, TSMC is offering universities the following resources – for teaching purposes, and for research projects leading to silicon test chips:

• Design collateral for teaching is based on TSMC’s N16 process, and includes tutorial design cases, training materials and instructional videos, bringing students from the conventional planar transistor structure into the FinFET era.
• For impactful research projects, TSMC is providing both N16 and N7 process design collateral for test chips to be manufactured via MPW. These include research designs in logic, analog, and radio frequency (RF).
  

“At TSMC, we are always looking towards the future – not only the future research that will become tomorrow’s technology breakthroughs, but the future talent who will become tomorrow’s innovators,” said Dr. Kevin Zhang, senior vice president of business development at TSMC. “By offering our 16nm and 7nm technology through the TSMC University FinFET Program, we open a whole new arena for researchers and students to explore their ideas, and fuel their curiosity and passion for the exciting and fast-growing field of semiconductors.”

TSMC’s technology and manufacturing is supported by a vibrant and comprehensive design enablement ecosystem, the Open Innovation Platform®. Our ecosystem of services partners is ready to connect scholars with the TSMC University FinFET Program, and academic institutions interested in joining the program are invited to contact service partners in their region at https://www.tsmc.com/english/dedicatedFoundry/services/university_program .

芯华

可以说是提供了一个练手的好机会。

Billmtk

good good good

chunk999

会扩散出来吧。

DavidChen三牛

台积用心险恶啊，用新一代FINFET教育下一代IC engineer

垂直雨林

DavidChen三牛 发表于 2023-2-9 10:29
台积用心险恶啊，用新一代FINFET教育下一代IC engineer

然后大家都不用其他工艺了？