Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering @2018

2046

There have been reported a lot of packaging technologies for MEMS devices such as inertial sensors, RF MEMS switches, and thermal sensors. The specific pack- aging solution may be needed for each MEMS device; for example, RF MEMS switches for millimeter-wave frequencies should be packaged in a very low-loss package. Among the packaging technologies presented, transfer packaging tech- nique allows to package the MEMS devices minimizing technological compatibility issues.

This book provides an overview of the MEMS packaging technologies including transfer technique for packaging and 3D integration. Concerning transfer packaging technique, polymer cap and thin-film cap transfer packaging technologies are described emphasizing on the solution for well-known carrier substrate removal of the transfer technique. The anti-adhesion monolayer-assisted debonding of the carrier substrate is technologically demonstrated, and comprehensive studies based on FEM modeling have been also explained.

This book is composed of six chapters. Chapters 1 and 2 overview MEMS packaging technologies and transfer packaging techniques. Chapter 3 addresses a transfer packaging technique based on polymer materials (BCB and PerMX) and thermomechanical modeling of the polymer cap packages. Chapter 4 addresses buckled thin-film cap transfer packaging technology and FEM simulation of the buckled thin-film package. Chapter 5 addresses FEM modeling of debonding of the transfer packaging. Other related examples of the anti-adhesion control technique are reviewed in Chap. 6.

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