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On-Chip ESD Protection Design

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发表于 2007-12-19 10:15:24 | 显示全部楼层 |阅读模式

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abbr_c26777561aac23deef204fec06241ea7.pdf (1.06 MB, 下载次数: 95 )
 楼主| 发表于 2007-12-19 10:18:37 | 显示全部楼层
good, thanks very much
头像被屏蔽
发表于 2007-12-19 12:16:17 | 显示全部楼层
提示: 作者被禁止或删除 内容自动屏蔽
发表于 2007-12-19 15:21:07 | 显示全部楼层
thanks!!!!!!!!!!!!!!!!
发表于 2007-12-19 19:50:22 | 显示全部楼层
The same to me!
发表于 2007-12-19 20:28:41 | 显示全部楼层
好东西 ,谢谢
发表于 2007-12-31 17:37:54 | 显示全部楼层
thanks for sharing. but i feel cheated because it is a journal paper, not an e-book
发表于 2007-12-31 22:53:02 | 显示全部楼层
Abstract—Anew electrostatic discharge (ESD) protection structure
of high-voltage p-type silicon-controlled rectifier (HVPSCR)
that is embedded into a high-voltage p-channel MOS (HVPMOS)
device is proposed to greatly improve the ESD robustness of
the vacuum-fluorescent-display (VFD) driver IC for automotive
electronics applications. By only adding the additional n+ diffusion
into the drain region of HVPMOS, the transmission-linepulsing-
measured secondary breakdown current of the output
driver has been greatly improved to be greater than 6 A in a
0.5-μm high-voltage complementary MOS process. Such ESDenhanced
VFD driver IC, which can sustain human-body-model
ESD stress of up to 8 kV, has been in mass production for automotive
applications in cars without the latchup problem. Moreover,
with device widths of 500, 600, and 800 μm, the machine-model
ESD levels of the HVPSCR are as high as 1100, 1300, and 1900 V,
respectively.
Index Terms—Electrostatic discharge (ESD), high-voltage
p-type silicon-controlled rectifier (HVPSCR), human body model
(HBM), machine model (MM), secondary breakdown current
(It2), vacuum fluorescent display (VFD).
发表于 2008-1-5 11:25:51 | 显示全部楼层
发表于 2008-3-14 05:09:51 | 显示全部楼层
是paper啊,还以为是书
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