|
马上注册,结交更多好友,享用更多功能,让你轻松玩转社区。
您需要 登录 才可以下载或查看,没有账号?注册
x
本帖最后由 joshuacp 于 2019-2-28 14:46 编辑
DesignCon2019所有论文打包下载,内容涉及以下方面。
注意:下载压缩包解压缩时需要密码,回复本贴后,密码自动显示。
All DesignCon content, including every track in the conference, is revised annually to include the latest research. Below are new elements to expect per track for 2019:
1. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
2. Chip I/O & Functional Block Modeling & Validation Solutions
3. Integrating Photonic & Wireless In Electrical Design
4. System Co-Design: Modeling, Simulation & Measurement Validation
5. Advances In Materials & Processing For PCBS, Modules & Packages
6. Applying Chip-To-Chip & Advanced PCB Design & Simulation Techniques
7. Advanced I/O Interface Design for Memory & 2.5D/3D/SIP Integrations
8. Optimizing High-Speed Serial Design
9. Measurement, Simulation & Optimization of Jitter, Noise & Timing to Minimize Errors
10. High-Speed Signal Processing, Equalization & Coding
11. Power Integrity in Power Distribution Networks
12. Electromagnetic Compatibility/Mitigating Interference
13. Applying Test & Measurement Methodology
14. Modeling & Analysis of Interconnects
15. Machine Learning for Microelectronics, Signaling & System Design
DesignCon 2019.part01.rar
(15 MB, 下载次数: 839 )
DesignCon 2019.part02.rar
(15 MB, 下载次数: 768 )
DesignCon 2019.part03.rar
(15 MB, 下载次数: 736 )
DesignCon 2019.part04.rar
(15 MB, 下载次数: 721 )
DesignCon 2019.part05.rar
(15 MB, 下载次数: 747 )
DesignCon 2019.part06.rar
(15 MB, 下载次数: 724 )
DesignCon 2019.part07.rar
(15 MB, 下载次数: 727 )
DesignCon 2019.part08.rar
(10.21 MB, 下载次数: 710 )
|
|