刚开始学习ICC,使用的是SMIC55nm库,在用create_mw_lib命令创建库时,出现下述警告:Warning: Layer 'M1' has rounded fat table thresholds '(0, 1, 5)'. (line 340) (TFCHK-055)
Warning: Layer 'RDL' is missing the attribute 'minArea'. (line 749) (TFCHK-012)
Warning: ContactCode 'VIA_RDV' is missing the attribute 'unitMinResistance'. (line 1295) (TFCHK-014)
Warning: ContactCode 'VIA_RDV' is missing the attribute 'unitNomResistance'. (line 1295) (TFCHK-014)
Warning: ContactCode 'VIA_RDV' is missing the attribute 'unitMaxResistance'. (line 1295) (TFCHK-014)
Warning: Layer 'M1' has a pitch 0.2 that does not match the recommended wire-to-via pitch 0.21 or 0.18. (TFCHK-049)
Warning: Layer 'M6' has a pitch 0.2 that does not match the recommended wire-to-via pitch 0.34 or 0.38. (TFCHK-049)
Warning: Layer 'M3' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M4' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M5' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M6' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'TM2' has a pitch 0.8 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'RDL' has a pitch 5 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: CapModel sections are missing. Capacitance models should be loaded with a TLU+ file later. (TFCHK-084)
想请教一下,1.这些警告影不影响后续库使用?2.这些警告为什么会出现,即为什么会出现这种不吻合现象?
我也:
Warning: Layer 'AP' is missing the attribute 'minArea'. (line 744) (TFCHK-012)
Warning: Cut layer 'VIA1' has a non-cross primary default ContactCode 'VIA12'. (line 1207) (TFCHK-092)
Warning: Layer 'M1' has a pitch 0.2 that does not match the recommended wire-to-via pitch 0.225. (TFCHK-049)
Warning: Layer 'M7' has a pitch 0.2 that does not match the recommended wire-to-via pitch 0.41 or 0.35. (TFCHK-049)
Warning: Layer 'M9' has a pitch 0.8 that does not match the recommended wire-to-via pitch 3.6. (TFCHK-049)
Warning: Layer 'M3' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M4' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M5' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M6' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M7' has a pitch 0.2 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M8' has a pitch 0.8 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'M9' has a pitch 0.8 that does not match the doubled pitch 0.4 or tripled pitch 0.6. (TFCHK-050)
Warning: Layer 'AP' has a pitch 6.5 that does not match the doubled pitch 1.6 or tripled pitch 2.4. (TFCHK-050)
Warning: CapModel sections are missing. Capacitance models should be loaded with a TLU+ file later. (TFCHK-084)