Sputtering is one of the processes for depositing thin films on suitable substrates. The fundamentals of sputtering methods are well understood and related topics have been reviewed extensively in journal articles and book chapters. The source material for sputter deposition of thin films is called the sputtering target, which can be made using conventional metallurgical processes or using special processing techniques depending on the requirements of a particular application. Sputtering Materials for VLSI and Thin Film Devices is aimed at correlating the physics of sputtering, the characteristics of sputtering target, chamber design and thin film properties in an integrated manner to understand technologically-important manufacturing processes