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Title: Lead Physical Design Engineer (数字后端设计项目方向)
Location: SH
Position Description:
Perform physical design implementation, including floor planning, power grid design, place and route, clock tree synthesis, timing closure, power/signal integrity signoff, physical verification (DRC/LVS/Antenna), EM/IR signoff, DFM Closure.
The candidate will have the opportunity to work on many varieties of challenging designs, i.e. low power and high speed design. The responsibility includes participating in or leading next generation PHY IP physical design, methodology and flow development.
Position Requirements:
BS degree with 5+ years of applicable experience, MS degree with 3+ years of applicable experience in electrical engineering, microelectronics.
Experienced with ASIC design flow, hierarchical physical design strategies, and methodologies and understand deep sub-micron technology issues.
Solid knowledge on LP Design, static timing analysis, EM/IR-Drop/crosstalk analysis, physical verification, DFM.
Successful track records of taping out complex, 16nm/10nm/7nm chips. Automation and programming-minded, solid coding experience in Makefile/Tcl/Tk/Perl.
Self-motivated, able to work independently or as a team player, excellent verbal and written communication skills in English.
Title: Lead Physical Design Engineer (数字后端设计Research方向)
Location: SH
Position Description:
Co-work with the R&D RTL design team for IP architecture exploration and optimization of the design and constraint
Co-work with other functional teams (Design/STA/Analog/Package/Verification) to optimize the high speed PHY IP development flow and set proper signoff criteria.
Optimize the physical implementation methodology and flow to meet the tight timing/power target of next generation high speed PHY IP.
Set and optimize the high speed PHY IP physical implementation guide which will be used by customers and internal global physical implementation teams.
Perform physical design implementation tasks including floor planning, place&route, clock tree synthesis and Timing/PV/Power/Signal-EM/CLP/DFM signoff checks for some critical milestone projects.
Position Requirements:
BS degree with 6+ years of applicable experience, MS degree with 3+ years of applicable experience in electrical engineering, microelectronics.
Experienced with ASIC design flow, hierarchical physical design strategies, and methodologies and understand deep sub-micron technology issues.
Solid knowledge on LP Design, static timing analysis, EM/IR-Drop/crosstalk analysis, physical verification, DFM.
Successful track records of taping out complex, 16nm/10nm/7nm chips.
Automation and programming-minded, solid coding experience in Makefile/Tcl/Tk/Perl.
Innovative, self-motivated, able to work independently or as a team player.
Excellent verbal and written communication skills in English. |
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