芯原成都--招聘Engineer/Sr. Engineer of ZSP Verification

sunny555

芯原股份有限公司（芯原）是一家芯片设计平台即服务（Silicon Platform as a Service，SiPaaSTM）提供商，为包含移动互联设备、数据中心、物联网（IOT）、可穿戴设备、智能家居和汽车电子等多种终端市场在内的各种广泛应用提供以IP为中心的、基于平台的芯片定制服务和一站式端到端的半导体设计服务。  

芯原成立于2001年，总部位于中国上海，目前在全球已有超过600名员工。芯原在中国、美国和芬兰共设有6个设计研发中心，并在全球共设有9个销售和客户支持办事处。  

如需了解更多信息，欢迎关注公司官网：http://www.verisilicon.com/  





芯原微电子（成都）有限公司诚邀您的加入！！！  

公司地址：天府软件园C区10栋23楼；  

简历投递邮箱：yujuan.li@verisilicon.com



职位信息如下：

Engineer/Sr. Engineerof ZSP Verification

Responsibilities:

1. Developenvironments for ZSP system functional verification.

2. Write verificationplans for ZSP system level IPs and systems.

3. Developverification environments for IP and systems using C, verilog, Assembly,SystemVerilog, etc.

4. Contributeimprovements to verification methodologies, and toolsets.

5. Develop script for verificationflow with Python, Perl, etc.

                                 

Requirements:

1. 3-8 years workingexperience. BS/MS/PhD in Electrical/Computer Engineering.

2. Strong codingskills - using languages: Verilog, SystemVerilog, Perl, assembly, C++, C,Linux.

3. Great debuggingand problem isolation skills.

4. AXI, AHBinterconnect.

5. Computerarchitecture, memory subsystems.

6. Implementingverification methodologies including constrained random verification, coverageclosure, Assertion Based Verification, Universal Verification Methodology.

7. Background knowledge for dsp, cpu,Cache is better.

  欢迎大家投递或推荐，谢谢

sunny555

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