AMD苏州热招：Packaging Engineer

RecruiterAMD

DESCRIPTION OF DUTIES:
1. Responsible for Assembly & Packaging NPI at AMD Suzhou.
2. Lead new product Packaging/Assembly development and qualification at AMD Suzhou.
3. Drive and work with Assembly process team for yield improvement during NPI stage.
4. Participate in problem solving of Assembly & packaging related Failure Analysis.

5. Familiar with the quality and reliability test conditions and specifications.
6. Interface with materials suppliers (substrate, underfill, etc) for engineering and quality related issues.
7. Team lead responsible to guide junior engineers (optional).
8. Participate in MRB to review quality excursion and provide lot disposition.



REQUIRED KNOWLEDGE, SKILLS AND ABILITIES:

1. Project Management skills
2. Fluent in English and Chinese
3. Functional competency
• Good understanding of Semiconductor processes.
• Strong problem solving skills and ability to handle multiple projects concurrently.

• Experience and knowledgeable in Flip Chip C4 Assembly and Packaging including materials and process
• Experience and knowledgeable in substrate manufacturing process and wafer bumping is preferred
• Knowledge on Six Sigma and Lean, BB preferred

Position：Suzhou

有意者请将简历发送至nicole.yu@amd.com