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发表于 2015-11-12 08:40:45
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For each semiconductor process generation, the main purpose of the dimension shrinkage is to low the die area and power consumption. So, VDD will be decreased due to:
1. Gate oxide became thinner. So, the upper limit of Vgs, Vgd and Vgb will become lower. So, VDD must be decreased.
2. P-N Junction breakdown voltage will be lower due to shallow junction.
3. MOS channel will be much easier to punch through due to shorter channel length.
As for the reason of Lmin=100nm of gpdf90, it might be the reason that the MOS device (especially NMOS) is easier to punch through if L=90nm is applied. |
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