上海美资高薪诚聘精英

talentslink · 发表于 2003-12-23 16:13:52

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1: RFIC Design Engineer （射频芯片设计） (HC:1)
Qual: MSEE or PhD, approximately 3-5 years industry experience. Hands-on design experience with LNA, mixer, PLL, VCO, filter, etc with Cadence is required. Knowledge about device modeling and RF system. Good English communication skills.
2: Analog/Mixed-signal Design Engineer (HC:1)
Qual: MSEE or PHD, approximately 3-5 years industry experience, Hands-on design experience with PLL, filter, D/A, A/D and Sigma--delta, etc with Cadence is required. Good knowledge about device modeling and RF system. Good English communication skills.

Function: Analog/mixed IC design
3: Sr. RF Board Design Engineer (HC:2)
Qual: BSEE, 8-10 years industry experience. Familiar with RF matching network, Smith chart, microstrip design, RF board level design and evaluation.
Knowing PCB design tool such as ORCAD, PADS, Protel/PowerPCB, ADS. 900MHz~3GHz freq. range is preferred. Strong communication skills and tech. leadership. Good English communication skills.
Function: lead internal RF system design. Work with partners/customers. Reference design.
4: Senior layout engineer (HC:1)
1)BSEE above , at least 5 years of RF layout/Analog experience.
2)Familiar with Vitruoso ,Calibre and Layout_XL tools
3)Experience of project tapout is preferred
4)Good communication skill and team spirit.
5)Good capability in learning new technology
5: Layout Engineer (HC:1)
1)BSEE above, at least 3 years of RF/Analog layout experience.
2)Familiar with Vitruoso, Calibre and Layout_XL tools
3)Experience of Apollo P&R is preferred.
4)Good communication skill and team spirit.
5)Good capability in learning new technology.
6: Production Engineer/Test Engineer (Hardware) (HC:1)
Requirement:
-BSEE/MSEE in semiconductor device or IC related area
-5+ years IC industry experience, 2+ years with backend, device/chip characterization and evaluation, product, yield enhancement and failure analysis. IC design experience is a plus.
-Familiar with various tools required to perform jobs.
-Technical leadership in setting up and implementing backend capability of a fables IC start-up
Job Description:
-Backend: test and characterization, product, QA, FA, yield enhancement and product qualification, etc.
7. Sr. Product Manager/Director (HC:2)
Requirement:
-BSEE/MSEE in semiconductor device or IC related area
-10+ years IC industry experience, 5+ years with backend, device/chip characterization and evaluation, product, yield enhancement and failure analysis. IC design experience a plus.
-Familiar with various tools required to perform jobs.
-Technical leadership in setting up and implementing backend capability of a fables IC start-up
Job Description:
-Backend: test and characterization, product, QA, FA, yield enhancement, product qualification, FAE, applications, production ramp-up, etc.
-Foundry, packaging/testing house interface, etc.
-Interface with tech. And production team within the corp.
-setting up and implementing backend capability of a fables IC start-up
8. FAE/Application (HC:1)
Responsibilities:
1.Provide technical support to OEM & distributors
2.Drive design win in OEM & distributors projects
3.Handle failure analysis and customer development issues
Requirement
1.Minimum Bachelor degree in EE
2.Have 5 or more years R&D working experience in wireless communication industries
3.Have extensive RF system background and familiar with communication system
4.Good oral and written English
5.Outgoing character, innovative, could work under pressure and willing to travel
9. Digital/ASIC Design Engineer (HC:1)
BSEE/MSEE, 3~5 years industory experience, Knowledge of digital design, VHDL/verilog coding, system architecture, device/circuit design knowledge is a plus, Familiar with Cadence, Synopsis, ModelSim, etc.