Cadence SPB16.2入门教程

sunowners

目录
第 1 章焊盘制作 .........................................................................................................1
1.1 用Pad Designer 制作焊盘...........................................................................................1
1.2 制作圆形热风焊盘.......................................................................................................6
第2 章建立封装 .......................................................................................................10
2.1 新建封装文件.............................................................................................................10
2.2 设置库路径.................................................................................................................11
2.3 画元件封装.................................................................................................................12
第3 章元器件布局 ...................................................................................................23
3.1 建立电路板(PCB) ......................................................................................................23
3.2 导入网络表.................................................................................................................24
3.3 摆放元器件.................................................................................................................26
第4 章 PCB 布线.......................................................................................................31
4.1 PCB 层叠结构............................................................................................................31
4.2 布线规则设置.............................................................................................................33
4.2.1 对象(object) ....................................................................................................35
4.2.2 建立差分对.....................................................................................................36
4.2.3 差分对规则设置.............................................................................................37
4.2.4 CPU 与DDR 内存芯片走线约束规则..........................................................39
4.2.5 设置物理线宽和过孔.....................................................................................45
4.2.6 设置间距约束规则.........................................................................................52
4.2.7 设置相同网络间距规则.................................................................................55
4.3 布线.............................................................................................................................56
4.3.1 手工拉线.........................................................................................................56
4.3.2 应用区域规则.................................................................................................59
4.3.3 扇出布线.........................................................................................................60
4.3.4 差分布线.........................................................................................................62
4.3.5 等长绕线.........................................................................................................64
4.3.6 分割平面.........................................................................................................65
第5 章输出底片文件 ...............................................................................................70
5.1 Artwork 参数设置......................................................................................................70
5.2 生成钻孔文件.............................................................................................................75
5.3 输出底片文件.............................................................................................................79

ayaya-slh

谢谢，谢谢