[Marvell Cellular手机部门]招聘DSP Engineer

Hwangbo

1、Job Title: DSP System Engineer

Department: Cellular Engineering

Location: Shanghai

Job Description:

Physical Layer System Engineer for 3G/GSM UE

Marvell Shanghai is now looking for the TD-SCDMA, WCDMA, and GSM physical layer engineers to join us in 3G/2G production. As a worldwide leading fabless semiconductor company, we are working on 3G/2G communication product and technology. You would join in us in the design, development, implementation and debug of advanced physical layer firmware and system for the wireless communication productions.

Qualification:

- A minimum of Bachelor degree in Electrical Engineering is required with specialization in DSP or communication

- Experience in the develop of the physical layer or L1 Controller of 3G/2G (TD-SCDMA, WCDMA, GSM) are preferred

- Related experience in the 3G/2G system design, Dual RAT, HSPA and system testing is a good plus

- Strong Digital Signal Processing knowledge in the area of digital communication system and of various digital modulation schemes

- Good written and oral English skills

- Good Team work

2、Job Title: DSP/Firmware Engineer

Department: Cellular Engineering

Location: Shanghai

Job Description:

-We are looking for a DSP/Firmware Engineer with solid background in digital communication and signal processing to join our system design team for wireless communication system, include 2G/3G/4G.

-The successful candidate is expected to work in a collaborative team on cutting-edge data communication technologies. Responsibility includes designing algorithm and architecture and implementation for the physical layer of the modems.

-This position also requires close interaction with the digital design team on design specification, verification and test.

Qualification:

-M.S.or Ph.D in Electrical Engineering

-About 3 yrs working experience.

-Must have strong knowledge of digital communication and signal processing theory

-Proficient in building up communication system simulator with C/C++ and Matlab

-Knowledge and experience on the communication physical layer are preferred

-Familiarity with DSP and RTL implementation is a good plus.

-Good communication skills in spoken and written English

-Good at collaboration and team work

3、Job Title: DSP Engineer (TD/LTE)

Department: Cellular Engineering

Location: Shanghai

Job Description:

-We are looking for a DSP/Firmware Engineer with solid background in digital communication and signal processing to join our system design team for wireless communication system, include 2G/3G/4G.

-The successful candidate is expected to work in a collaborative team on cutting-edge data communication technologies. Responsibility includes designing algorithm and architecture and implementation for the physical layer of the modems.

-This position also requires close interaction with the digital design team on design specification, verification and test.

Qualification:

-M.S.or Ph.D in Electrical Engineering

-About 3 yrs working experience.

-Must have strong knowledge of digital communication and signal processing theory

-Proficient in building up communication system simulator with C/C++ and Matlab

-Knowledge and experience on the communication physical layer are preferred

-Familiarity with DSP and RTL implementation is a good plus.

-Good communication skills in spoken and written English

-Good at collaboration and team work

4、Job Title: DSP/Firmware Audio Engineer

Department: Cellular Engineering

Location: Shanghai

Job Description:

-We are looking for a Senior DSP/Firmware Engineer with solid background in audio processing to join our system design team for wireless communication system, include 2G/3G/4G

-Help customer do audio design related to the implementation with acoustic components and hardware circuit

-Cooperate with customer to definite and develop audio DSP block

-Instruct customer to implement audio tuning

-Support customer to analyze and solve audio related problems

Qualification:

-B.Sc. in Signal & information Processing Engineering, Electronic Engineering, Telecommunication Engineering or other relevant major

-At least 3 years of relevant working experience with emphasis on audio DSP tuning, hardware circuit design

-Familiar with mobile phone test Standard

-Familiar with acoustic design of audio components

-Familiar with architecture application of one audio DSP processor

-Have the basic knowledge of signal process algorithm, such as echo cancellation and so on

-Knowledge and experience on the communication physical layer are preferred

-Good communication skills in spoken and written English

-Good at collaboration and team work

If you are interested in any one of the four positions, please send your resume to the following email address:   jiangrr@marvell.com

Subject of your email should be: School_Name_Applied position_Information source
Eg.SJTU_Zhang Peng _Data Analyst_BBS