上海需要一位 Package Engineer_Sr Development COF

KT咨询-IC电子

【猎头职位：上海需要一位  Package Engineer_Sr Development COF】联系人：Amy-Dong，邮箱：hr@kthr.com，微信也可查询职位啦！打开手机微信，搜号码“KTHR_COM”或查找微信公众帐号“KT人才”或扫描以上二维码即可添加，欢迎大家关注！
Responsibilities:
•Co-design package/modules with layout specialist
•Develop custom Chip on Flex package/modules with suppliers
•Develop and define assembly processes, troubleshoot and provide initial production ramp and sustaining support on packaging/module launch
•Communicate across groups within internal regarding needs in ramping up new technologies (manufacturing processes, materials, testing requirements, sourcing, etc.)
&#8226rovide direction to chip designer during the developmental stage to design an optimum pad layout for most cost effective package
•Help assess manufacturability of new module and assembly technologies
•Manage logistics, materials and education needed to transfer new technologies into selected manufacturing sites; Work with marketing and chip lead to select packages and Define packaging cost and roadmap for new devices; Lead new packaging and process technology development and the deployment of the technology in HVM
•Work closely with QA and customer to resolve quality issues
•Interface with packaging vendors to identify quality, production and technology capabilities, technology improvement plans and cost reduction goals
•Travel to manufacturing sites to make assessments of their technical capability and report back to company


Required Experience:
•Minimum 7 years’ experience in semiconductor package development, layout and characterization. At least 2 years of Chip on Flex experience.
•BS or greater, preferably in Physics, Mechanical Engineering, Chemical Engineering, Material Science or a closely related field
•Excellent communication, reasoning and problem-solving skills
•Experience in manufacturing consumer electronics products
•Knowledge of manufacturing process control
•Experience with package and module development processes including writing specifications, design, and validation
•Solid background with hands on work ethic, team player with experience working across geographically diverse teams.
•Ability to work creatively and independently with minimum supervision following specifications and project schedule.
•Experience with tools used in package design and circuit, electromagnetic and thermal simulation and characterization with especially strong authority on Cadence APD/APE, ACAD for custom substrate and module design


Nice to have these additional experiences:
•Background in sensor packaging
•Flip chip on laminate or flex substrate, SMT and Chip attach processes
•Flex substrate package development
•Materials processing including coating and molding
•Antenna radiation and ESD characterization and improvement