考虑到single via的良率问题,想在EDI中完成double via。按照edi userguider中的说明,定义了如下几个孔:
VIA VIACENTER23
LAYER M3 ;
RECT -2.2 -2.2 2.2 2.2 ;
LAYER CUT23 ;
RECT -0.8 -0.8 0.8 0.8 ;
LAYER M2 ;
RECT -2.0 -2.0 2.0 2.0 ;
END VIACENTER23
VIA VIATOP23
LAYER M3 ;
RECT -2.2 -2.2 2.2 8.2 ;
LAYER CUT23 ;
RECT -0.8 5.2 0.8 6.8 ;
LAYER M2 ;
RECT -2.2 -2.2 2.2 8.2 ;
END VIATOP23
VIA VIABOTTOM23
LAYER M3 ;
RECT -2.2 -8.2 2.2 2.2 ;
LAYER CUT23 ;
RECT -0.8 -6.8 0.8 -5.2 ;
LAYER M2 ;
RECT -2.2 -8.2 2.2 2.2 ;
END VIABOTTOM23
VIA VIALEFT23
LAYER M3 ;
RECT -7.8 -2.2 2.2 2.2 ;
LAYER CUT23 ;
RECT -6.4 -0.8 -4.8 0.8 ;
LAYER M2 ;
RECT -7.8 -2.2 2.2 2.2 ;
END VIALEFT23
VIA VIARIGHT23
LAYER M3 ;
RECT -2.2 -2.2 7.8 2.2 ;
LAYER CUT23 ;
RECT 4.8 -0.8 6.4 0.8 ;
LAYER M2 ;
RECT -2.2 -2.2 7.8 2.2 ;
END VIARIGHT23
VIARULE VIALIST23
LAYER M3 ;
DIRECTION VERTICAL ;
WIDTH 3.6 TO 3.6 ;
LAYER M2 ;
DIRECTION HORIZONTAL ;
WIDTH 3.0 TO 3.0 ;
VIA VIACENTER23 ;
VIA VIATOP23 ;
VIA VIABOTTOM23 ;
VIA VIALEFT23 ;
VIA VIARIGHT23 ;
END VIALIST23