过孔（Via）分析相关资料！

netshell · 发表于 2014-10-22 10:38:45

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An Accurate Equivalent Circuit Model of Flip Chip and Via Interconnects.pdf (1.27 MB , 下载次数: 27 )

Differential Vias Transition Modeling in a Multilayer Printed Circuit Board.pdf (514.17 KB , 下载次数: 19 )

Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures.pdf (1017.16 KB , 下载次数: 12 )

Full-Wave Characterization of a Through Hole Via in Multi-Layered Packaging.pdf (829.84 KB , 下载次数: 18 )

Full Wave Characterization of a Through Hole Via Discontinuity in Multi-Layered Packaging.pdf (282.51 KB , 下载次数: 9 )

Fullwave Simulation and Validation of a Complex Packaging Structure.pdf (720.73 KB , 下载次数: 14 )

Lumped-Circuit Model Extraction for Vias in Multilayer Substrates.pdf (699.59 KB , 下载次数: 13 )

High Frequency Equivalent Circuit Model of Via.pdf (195.55 KB , 下载次数: 12 )

Recent Development of Via Models Hybrid Circuit and Field Analysis.pdf (544.74 KB , 下载次数: 8 )

封装基板过孔电特性建模方法.pdf (933.87 KB , 下载次数: 19 )

The Excess Capacitance of a Microstrip Via in a Dielectric Substrate.pdf (500.64 KB , 下载次数: 12 )

高速PCB中过孔电容的分析.pdf (767.69 KB , 下载次数: 14 )

高速差分微带与过孔结构的全波及电路分析和研究.pdf (394.24 KB , 下载次数: 13 )

高速电路PCB过孔优化的仿真.pdf (1.68 MB , 下载次数: 32 )

固执的寻觅 · 发表于 2016-2-27 12:58:04

perfect materials~~

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