【电子书】Printed Circuit Handbook 6th

gellmann

PCB方面的百科全书式的资料
目录
Part 1 Lead-Free Legislation
Chapter 1. Legislation and Impact on Printed Circuits 1.3
1.1 Legislation Overview / 1.3
1.2 Waste Electrical and Electronic Equipment (WEEE) / 1.3
1.3 Restriction of Hazardous Substances (RoHS) / 1.3
1.4 RoHS’ Impact on the Printed Circuit Industry / 1.6
1.5 Lead-Free perspecives / 1.10
1.6 Other Legislative Initiatives / 1.10
Part 2 Printed Circuit Technology Drivers
Chapter 2. ELECTRONIC PACKAGING AND HIGH-DENSITY
INTERCONNECTIVITY 2.3
2.1 Introduction / 2.3
2.2 Measuring the Interconnectivity Revolution (HDI) / 2.3
2.3 Hierarchy of Interconnections / 2.6
2.4 Factors Affecting Selection of Interconnections / 2.7
2.5 ICS and Packages / 2.10
2.6 Density Evaluations / 2.14
2.7 Methods to Increase PWB Density / 2.16
References / 2.21
Chapter 3. Semiconductor Packaging Technology 3.1
3.1 Introduction / 3.1
3.2 Single-Chip Packaging / 3.5
3.3 Multichip Packages / 3.15
3.4 Optical Interconnects / 3.18
3.5 High-Density/High-Performance Packaging Summary / 3.21
3.6 Roadmap Information / 3.21
References / 3.21
Chapter 4. Advanced Component Packaging 4.1
4.1 Introduction / 4.1
4.2 Lead-Free / 4.2
4.3 System-on-a-Chip (SOC) versus System-on-a-Package (SOP) / 4.3

4.4 Multichip Modules / 4.5
4.5 Multichip Packaging / 4.6
4.6 Enabling Technologies / 4.10
4.7 Acknowledgment / 4.18
References / 4.18
Chapter 5. Types of Printed Wiring Boards 5.1
5.1 Introduction / 5.1
5.2 Classification of Printed Wiring Boards / 5.1
5.3 Organic and Nonorganic Substrates / 5.3
5.4 Graphical and Discrete-Wire Boards / 5.3
5.5 Rigid and Flexible Boards / 5.5
5.6 Graphically Produced Boards / 5.6
5.7 Molded Interconnection Devices / 5.10
5.8 Plated-Through-Hole (PTH) Technologies / 5.10
5.9 Summary / 5.13
References / 5.14
Part 3 Materials
Chapter 6. Introduction to Base Materials 6.3
6.1 Introduction / 6.1
6.2 Grades and Specifications / 6.3
6.3 Properties Used to Classify Base Materials / 6.9
6.4 Types of FR-4 / 6.13
6.5 Laminate Identification Scheme / 6.14
6.6 Prepreg Identification Scheme / 6.18
6.7 Laminate and Prepreg Manufacturing Processes / 6.18
References / 6.24
Chapter 7. Base Material Components 7.1
7.1 Introduction / 7.1
7.2 Epoxy Resin Systems / 7.1
7.3 Other Resin Systems / 7.5
7.4 Additives / 7.7
7.5 Reinforcements / 7.12
7.6 Conductive Materials / 7.18
References / 7.25
Chapter 8. Properties of Base Materials 8.1
8.1 Introduction / 8.1
8.2 Thermal, Physical, and Mechanical Properties / 8.1
8.3 Electrical Properties / 8.13
References / 8.16
Chapter 9. Base Materials Performance Issues 9.1
9.1 Introduction / 9.1
9.2 Methods of Increasing Circuit Density / 9.2
9.3 Copper foil / 9.2
9.4 Laminate Constructions / 9.7
9.5 Prepreg Options and Yield-Per-Ply Values / 9.9

9.6 Dimensional Stability / 9.10
9.7 High-Density Interconnect/Microvia Materials / 9.13
9.8 CAF Growth / 9.15
9.9 Electrical Performance / 9.22
References / 9.33
Chapter 10. The Impact of Lead-Free Assembly on Base Materials 10.1
10.1 Introduction / 10.1
10.2 RoHS Basics / 10.1
10.3 Base Material Compatibility Issues / 10.2
10.4 The Impact of Lead-Free Assembly on Base Material Components / 10.4
10.5 Critical Base Material Properties / 10.4
10.6 Impact on Printed Circuit Reliability and Material Selection / 10.18
10.7 Summary / 10.21
References / 10.22
Chapter 11. Selecting Base Materials for Lead-Free Assembly Applications 11.1
11.1 Introduction / 11.1
11.2 Pcb fabrication and Assembly Interactions / 11.1
11.3 Selecting the Right Base Material for Specific Application / 11.6
11.4 Example Application of this Tool / 11.14
11.5 Discussion of the Range of Peak Temperatures for Lead-Free Assembly / 11.15
11.6 Lead-Free Applications and Ipc-4101 Specification Sheets / 11.15
11.7 Additional Base material Options for Lead-Free Applications / 11.16
11.8 Summary / 11.17
References / 11.18
Chapter 12. Laminate Qualification and Testing 12.1
12.1 Introduction / 12.1
12.2 Industry Standards / 12.2
12.3 Laminate Test Strategy / 12.4
12.4 Initial Tests / 12.5
12.5 Full Material Characterization / 12.9
12.6 Characterization Test Plan / 12.22
12.7 Manufacturability in the Shop / 12.23
Part 4 Engineering and Design
Chapter 13. Physical Characteristics of the PCB 13.3
13.1 Classes of PCB Designs / 13.3
13.2 Types of PCBs or Packages for Electronic Circuits / 13.9
13.3 Methods of Attaching Components / 13.14
13.4 Component Package Types / 13.15
13.5 Materials Choices / 13.18
13.6 Fabrication Methods / 13.22
13.7 Choosing a Package Type and Fabrication Vendor / 13.24
Chapter 14. The PCB Design Process 14.1
14.1 Objective of the PCB Design Process / 14.1
14.2 Design Processes / 14.1

14.3 Design Tools / 14.6
14.4 Selecting a Set of Design Tools / 14.10
14.5 Interfacing Cae, Cad, and CAMTools to Each Other / 14.11
14.6 Inputs to the Design Process / 14.11
Chapter 15. Electrical and Mechanical Design Parameters 15.1
15.1 Printed Circuit Design Requirements / 15.1
15.2 Introduction to Electrical Signal Integrity / 15.1
15.3 Introduction to Electromagnetic Compatibility / 15.3
15.4 Noise Budget / 15.4
15.5 Designing for Signal Integrity and Electromagnetic Compatibility / 15.4
15.6 Mechanical Design Requirements / 15.9
References / 15.17
Chapter 16. Current Carrying Capacity in Printed Circuits 16.1
16.1 Introduction / 16.1
16.2 Conductor (Trace) Sizing Charts / 16.1
16.3 Current Carrying Capacity / 16.2
16.4 Charts / 16.6
16.5 Baseline Charts / 16.10
16.6 Odd-Shaped Geometries and the “Swiss Cheese” Effect / 16.19
16.7 Copper Thickness / 16.20
References / 16.21
Chapter 17. PCB Design for Thermal Performance 17.1
17.1 Introduction / 17.1
17.2 The PCB as a Heat Sink Soldered to the Component / 17.2
17.3 Optimizing the PCB for Thermal Performance / 17.3
17.4 Conducting Heat to the Chassis / 17.12
17.5 PCB Requirements for High-Power Heat Sink Attach / 17.14
17.6 Modeling the Thermal Performance of the PCB / 17.15
References / 17.18
Chapter 18. Information Formating and Exchange 18.1
18.1 Introduction to Data Exchange / 18.1
18.2 The Data Exchange Process / 18.3
18.3 Data Exchange Formats / 18.9
18.4 Drivers for Evolution / 18.22
18.5 Acknowledgment / 18.23
References / 18.23
Chapter 19. Planning for Design, Fabrication, and Assembly 19.1
19.1 Introduction / 19.1
19.2 General Considerations / 19.3
19.3 New Product Design / 19.4
19.4 layout Trade-off Planning / 19.10
19.5 PWB Fabrication Trade-off Planning / 19.17
19.6 Assembly Trade

Chapter 20. Manufacturing Information, Documentation,
and Transfer Including CAM Tooling for Fab and Assembly 20.1
20.1 Introduction / 20.1
20.2 Manufacturing Information / 20.2
20.3 Initial Design Review / 20.7
20.4 Design Input / 20.15
20.5 Design Analysis and Review / 20.19
20.6 The CAM-Tooling Process / 20.19
20.7 Additional Processes / 20.31
20.8 Acknowledgment / 20.32
Chapter 21. Embedded Components 21.1
21.1 Introduction / 21.1
21.2 Definitions and Example / 21.1
21.3 Applications and Trade-Offs / 21.2
21.4 Designing for Embedded Component Applications / 21.3
21.5 Materials / 21.6
21.6 Material Supply Types / 21.9
Part 5 High Density Interconnection
Chapter 22. Introduction to High-Density Interconnection (HDI) Technology 22.3
22.1 Introduction / 22.3
22.2 Definitions / 22.3
22.3 HDI Structures / 22.7
22.4 Design / 22.11
22.5 Dielectric Materials and Coating Methods / 22.13
22.6 HDI Manufacturing Processes / 22.26
References / 22.34
Bibliography-Additional Reading / 22.35
Chapter 23. Advanced High-Density Interconnection (HDI) Technologies 23.1
23.1 Introduction / 23.1
23.2 Definitions of HDI Process Factors / 23.1
23.3 HDI Fabrication Processes / 23.3
23.4 Next-Generation HDI Processes / 23.33
References 23.37
Part 6 Fabrication
Chapter 24. Drilling Processes 24.3
24.1 Introduction / 24.3
24.2 Materials / 24.4
24.3 Machines / 24.11
24.4 Methods / 24.15
24.5 Hole Quality / 24.18
24.6 Postdrilling Inspection / 24.20
24.7 Drilling Cost Per Hole / 24.2

Chapter 25. Precision Interconnect Drilling 25.1
25.1 Introduction / 25.1
25.2 Factors Affecting High-Density Drilling / 25.1
25.3 Laser versus Mechanical / 25.2
25.4 Factors Affecting High-Density Drilling / 25.5
25.5 Depth-Controlled Drilling Methods / 25.10
25.6 High-Aspect-Ratio Drilling / 25.10
25.7 Innerlayer Inspection of Multilayer Boards / 25.13
Chapter 26. Imaging 26.1
26.1 Introduction / 26.1
26.2 Photosensitive Materials / 26.2
26.3 Dry-Film Resists / 26.4
26.4 Liquid Photoresists / 26.7
26.5 Electrophoretic Depositable Photoresists / 26.8
26.6 Resist Processing / 26.8
26.7 Design for Manufacturing / 26.27
References / 26.29
Chapter 27. Multilayer Materials and Processing 27.1
27.1 Introduction / 27.1
27.2 Printed Wiring Board Materials / 27.2
27.3 Multilayer Construction Types / 27.16
27.4 ML-PWB Processing and Flows / 27.37
27.5 Lamination Process / 27.51
27.6 Lamination Process Control and Troubleshooting / 27.59
27.7 Lamination Overview / 27.63
27.8 ML-PWB Summary / 27.63
References / 27.63
Chapter 28. Preparing Boards for Plating 28.1
28.1 Introduction / 28.1
28.2 Process Decisions / 28.1
28.3 Process Feedwater / 28.3
28.4 Multilayer PTH Preprocessing / 28.4
28.5 Electroless Copper / 28.8
28.6 Acknowledgment / 28.11
References / 28.11
Chapter 29. Electroplating 29.1
29.1 Introduction / 29.1
29.2 Electroplating Basics / 29.1
29.3 High-Aspect Ratio Hole and Microvia Plating / 29.2
29.4 Horizontal Electroplating / 29.4
29.5 Copper Electroplating General Issues / 29.6
29.6 Acid Copper Sulfate Solutions and Operation / 29.14
29.7 Solder (Tin-Lead) Electroplating / 29.19
29.8 Tin Electroplating / 29.21
29.9 Nickel Electroplating / 29.23
29.10 Gold Electroplating / 29.25
29.11 Platinum Metals / 29.28
29.12 Silver Electroplating / 29.29

29.13 Laboratory Process control / 29.29
29.14 Acknowledgment / 29.31
References / 29.31
Chapter 30. Direct Plating 30.1
30.1 Direct Metallization Technology / 30.1
References / 30.11
Chapter 31. PWB Manufacture Using Fully Electroless Copper 31.1
31.1 Fully Electroless Plating / 31.1
31.2 The Additive Process and its Variations / 31.2
31.3 Pattern-Plating Additive / 31.2
31.4 Panel-Plate Additive / 31.7
31.5 Partly Additive / 31.8
31.6 Chemistry of Electroless Plating / 31.9
31.7 Fully Electroless Plating Issues / 31.12
References / 31.14
Chapter 32. Printed Circuit Board Surface Finishes 32.1
32.1 Introduction / 32.1
32.2 Alternative Finishes / 32.3
32.3 Hot Air Solder Level (Hasl or Hal) / 32.4
32.4 Electroless Nickel Immersion Gold (ENIG) / 32.6
32.5 Organic Solderability Preservative (OSP) / 32.8
32.6 Immersion Silver / 32.10
32.7 Immersion Tin / 32.11
32.8 Other Surface Finishes / 32.13
32.9 Assembly Compatibility / 32.14
32.10 Reliability Test Methods / 32.17
32.11 Special Topics / 32.18
32.12 Failure Modes / 32.19
32.13 Comparing Surface Finish Properties / 32.23
References / 32.23
Chapter 33. Solder Mask 33.1
33.1 Introduction / 33.1
33.2 Trends and Challenges for Solder Mask / 33.2
33.3 Types of Solder Mask / 33.3
33.4 Solder Mask Selection / 33.4
33.5 Solder Mask Application and Processing / 33.9
33.6 VIA Protection / 33.18
33.7 Solder Mask Final Properties / 33.19
33.8 Legend and Marking (Nomenclature) / 33.19
Chapter 34. Etching Process and Technologies 34.1
34.1 Introduction / 34.1
34.2 General Etching Considerations and Procedures / 34.2
34.3 Resist Removal / 34.4
34.4 Etching Solutions / 34.6
34.5 Other Materials for Board Construction / 34.18
34.6 Metals Other than Copper / 34.19
34.7 Basics of Etched Line Formation / 34.20

34.8 Equipment and Techniques / 34.26
References / 34.29
Chapter 35. Machining and Routing 35.1
35.1 Introduction / 35.1
35.2 Punching Holes (Piercing) / 35.1
35.3 Blanking, Shearing, and Cutting of Copper-Clad Laminates / 35.3
35.4 Routing / 35.6
35.5 Scoring / 35.13
35.6 Acknowledgment / 35.15
Part 7 Bare Board Test
Chapter 36. Bare Board Test Objectives and Definitions 36.3
36.1 Introduction / 36.3
36.2 The Impact of HDI / 36.3
36.3 Why Test? / 36.4
36.4 Circuit Board Faults / 36.6
Chapter 37. Bare Board Test Methods 37.1
37.1 Introduction / 37.1
37.2 Nonelectrical Testing Methods / 37.1
37.3 Basic Electrical Testing Methods / 37.2
37.4 Specialized Electrical Testing Methods / 37.9
37.5 Data and Fixture Preparation / 37.13
37.6 Combined Testing Methods / 37.20
Chapter 38. Bare Board Test Equipment 38.1
38.1 Introduction / 38.1
38.2 System Alternatives / 38.1
38.3 Universal Grid Systems / 38.3
38.4 Flying-Probe/Moving-Probe Test Systems / 38.17
38.5 Verification and Repair / 38.21
38.6 Test Department Planning and Management / 38.22
Chapter 39. HDI Bare Board Special Testing Methods 39.1
39.1 Introduction / 39.1
39.2 Fine-Pitch Tilt-Pin Fixtures / 39.2
39.3 Bending Beam Fixtures / 39.3
39.4 Flying Probe / 39.3
39.5 Coupled Plate / 39.3
39.6 Shorting Plate / 39.4
39.7 Conductive Rubber Fixtures / 39.5
39.8 Optical Inspection / 39.5
39.9 Noncontact Test Methods / 39.5
39.10 Combinational Test Methods / 39.7

Part 8 Assembly
Chapter 40. Assembly Processes 40.3
40.1 Introduction / 40.3
40.2 Through-Hole Technology / 40.5
40.3 Surface-Mount Technology / 40.16
40.4 Odd-Form Component Assembly / 40.42
40.5 Process Control / 40.48
40.6 Process Equipment Selection / 40.54
40.7 Repair and Rework / 40.57
40.8 Conformal Coating, Encapsulation, and Underfill Materials / 40.64
40.9 Acknowledgment / 40.66
Chapter 41. Conformal Coating 41.1
41.1 Introduction / 41.1
41.2 Types of Conformal Coatings / 41.3
41.3 Product Preparation / 41.6
41.4 Application Processes / 41.7
41.5 Cure, Inspection, and Finishing / 41.11
41.6 Repair Methods / 41.13
41.7 Design for Conformal Coating / 41.14
References / 41.17
Part 9 Solderability Technology
Chapter 42. Solderability: Incoming Inspection and Wet Balance Technique 42.3
42.1 Introduction / 42.3
42.2 Solderability / 42.4
42.3 Solderability Testing—a Scientific Approach / 42.8
42.4 The Influence of Temperature on Test Results / 42.13
42.5 Interpreting the Results:Wetting Balance Solderability Testing / 42.14
42.6 Globule Testing / 42.15
42.7 PCB Surface Finishes and Solderability Testing / 42.16
42.8 Component Solderability / 42.22
Chapter 43. Fluxes and Cleaning 43.1
43.1 Introduction / 43.1
43.2 Assembly Process / 43.2
43.3 Surface Finishes / 43.3
43.4 Soldering Flux / 43.5
43.5 Flux Form Versus Soldering Process / 43.6
43.6 Rosin Flux / 43.7
43.7 Water-Soluble Flux / 43.8
43.8 Low Solids Flux / 43.9
43.9 Cleaning Issues / 43.10
43.10 Summary / 43.12
References / 43.12

Part 10 Solder Materials and Processes
Chapter 44. Soldering Fundamentals 44.3
44.1 Introduction / 44.3
44.2 Elements of a Solder Joint / 44.4
44.3 The Solder Connection to the Circuit Board / 44.4
44.4 The solder Connection to the Electrical Component / 44.5
44.5 Common Metal-Joining Methods / 44.5
44.6 Solder Overview / 44.9
44.7 Soldering Basics / 44.9
Chapter 45. Soldering Materials and Metallurgy 45.1
45.1 Introduction / 45.1
45.2 Solders / 45.2
45.3 Solder Alloys and Corrosion / 45.4
45.4 PB-Free Solders: Search for Alternatives and Implications / 45.5
45.5 PB-Free Elemental Alloy Candidates / 45.5
45.6 Board Surface Finishes / 45.11
References / 45.19
Chapter 46. Solder Fluxes 46.1
46.1 Introduction to Fluxes / 46.1
46.2 Flux Activity and Attributes / 46.2
46.3 Flux: Ideal Versus Reality / 46.3
46.4 Flux Types / 46.4
46.5 Water-Clean (Aqueous) Fluxes / 46.4
46.6 No-Clean Flux / 46.7
46.7 Other Fluxing Caveats / 46.9
46.8 Soldering Atmospheres / 46.12
References / 46.15
Chapter 47. Soldering Techniques 47.1
47.1 Introduction / 47.1
47.2 Mass Soldering Methods / 47.1
47.3 Oven Reflow Soldering / 47.1
47.4 Wave Soldering / 47.28
47.5 Wave Solder Defects / 47.39
47.6 Vapor-Phase Reflow Soldering / 47.42
47.7 Laser Reflow Soldering / 47.43
47.8 Tooling and the Need for Coplanarity and Intimate Contact / 47.50
47.9 Additional Information Sources / 47.53
47.10 Hot-Bar Soldering / 47.53
47.11 Hot-Gas Soldering / 47.58
47.12 Ultrasonic Soldering / 47.59
References / 47.61
Chapter 48. Soldering Repair and Rework 48.1
48.1 Introduction / 48.1
48.2 Hot-Gas Repair / 48.1

48.3 Manual Solder Fountain / 48.5
48.4 Automated Solder Fountain / 48.6
48.5 Laser / 48.6
48.6 Considerations for Repair / 48.6
Reference / 48.7
Part 11 Nonsolder Interconnection
Chapter 49. Press-Fit Interconnection 49.3
49.1 Introduction / 49.3
49.2 The Rise of Press-Fit Technology / 49.3
49.3 Compliant Pin Configurations / 49.4
49.4 Press-Fit Considerations / 49.6
49.5 Press-Fit Pin Materials / 49.7
49.6 Surface Finishes and Effects / 49.8
49.7 Equipment / 49.10
49.8 Assembly Process / 49.11
49.9 Press Routines / 49.12
49.10 PWB Design and Board Procurement Tips / 49.14
49.11 Press-Fit Process Tips / 49.15
49.12 Inspection and Testing / 49.16
49.13 Soldering and Press-Fit Pins / 49.17
References / 49.17
Chapter 50. Land Grid Array Interconnect 50.1
50.1 Introduction / 50.1
50.2 LGA and the Environment / 50.1
50.3 Elements of the LGA System / 50.2
50.4 Assembly / 50.5
50.5 Printed Circuit Assembly (PCA) Rework / 50.7
50.6 Design Guidelines / 50.8
Reference / 50.8
Part 12 Quality
Chapter 51. Acceptability and Quality of Fabricated Boards 51.3
51.1 Introduction / 51.3
51.2 Specific Quality and Acceptability Criteria by PCB Type / 51.4
51.3 Methods for Verification of Acceptability / 51.6
51.4 Inspection Lot Formation / 51.7
51.5 Inspections Categories / 51.8
51.6 Acceptability and Quality After Simulated Solder Cycle(s) / 51.8
51.7 Nonconforming PCBS and Material Review Board (MRB) Function / 51.10
51.8 The Cost of the Assembled PCB / 51.11
51.9 How to Develop Acceptability and Quality Criteria / 51.11
51.10 Class of Service / 51.13
51.11 Inspection Criteria / 51.13
51.12 Reliability Inspection Using Accelerated Environmental Exposure / 51.32

Chapter 52. Acceptability of Printed Circuit Board Assemblies 52.1
52.1 Understanding Customer Requirements / 52.1
52.2 Handling to Protect the PCBA / 52.7
52.3 PCBA Hardware Acceptability Considerations / 52.10
52.4 Component Installation or Placement Requirements / 52.15
52.5 Component and PCB Solderability Requirements / 52.25
52.6 Solder-Related Defects / 52.25
52.7 PCBA Laminate Condition, Cleanliness, and Marking Requirements / 52.32
52.8 PCBA Coatings / 52.34
52.9 Solderless Wrapping of Wire to Posts (Wire Wrap) / 52.35
52.10 PCBA Modifications / 52.37
References / 52.39
Chapter 53. Assembly Inspection 53.1
53.1 Introduction / 53.1
53.2 Definition of Defects, Faults, Process Indicators, and Potential Defects / 53.3
53.3 Reasons for Inspection / 53.4
53.4 Lead-Free Impact on Inspection / 53.6
53.5 Miniaturization and Higher Complexity / 53.8
53.6 Visual Inspection / 53.8
53.7 Automated Inspection / 53.12
53.8 Three-Dimensional Automated Solder Paste Inspection / 53.14
53.9 PRE-Reflow Aoi / 53.16
53.10 Post-Reflow Automated Inspection / 53.17
53.11 Implementation of Inspection Systems / 53.23
53.12 Design Implications of Inspection Systems / 53.24
References / 53.25
Chapter 54. Design for Testing 54.1
54.1 Introduction / 54.1
54.2 Definitions / 54.2
54.3 AD HOC Design for Testability / 54.2
54.4 Structured Design for Testability / 54.4
54.5 Standards-Based Testing / 54.5
References / 54.12
Chapter 55. Loaded Board Testing 55.1
55.1 Introduction / 55.1
55.2 The process of Test / 55.1
55.3 Definitions / 55.4
55.4 Testing Approaches / 55.7
55.5 In-Circuit Test Techniques / 55.11
55.6 Alternatives to Conventional Electrical Tests / 55.17
55.7 Tester Comparison / 55.19
References / 55.20
Part 13 Reliability
Chapter 56. Conductive Anodic Filament Formation 56.3
56.1 Introduction / 56.3
56.2 Understanding CAF Formation / 56.3

56.3 Electrochemical Migration and Formation of CAF / 56.7
56.4 Factors that Affect CAF Formation / 56.10
56.5 Test Method for CAF-Resistant Materials / 56.14
56.6 Manufacturing Tolerance Considerations / 56.14
References / 56.15
Chapter 57. Reliability of Printed Circuit Assemblies 57.1
57.1 Fundamentals of Reliability / 57.2
57.2 Failure Mechanisms of PCBS and Their Interconnects / 57.4
57.3 Influence of Design on Reliability / 57.19
57.4 Impact of PCB Fabrication and Assembly on Reliability / 57.20
57.5 Influence of Materials Selection on Reliability / 57.27
57.6 Burn-in, Acceptance Testing, and Accelerated Reliability Testing / 57.36
57.7 Summary / 57.45
References / 57.45
Further Reading / 57.47
Chapter 58. Component-to-PWB Reliability: The Impact of Design
Variables and Lead Free 58.1
58.1 Introduction / 58.1
58.2 Packaging Challenges / 58.2
58.3 Variables that Impact Reliability / 58.5
References / 58.30
Chapter 59. Component-to-PWB Reliability: Estimating Solder-Joint
Reliability and the Impact of Lead-Free Solders 59.1
59.1 Introduction / 59.1
59.2 Thermomechanical Reliability / 59.3
59.3 Mechanical Reliability / 59.20
59.4 Finite Element Analysis (FEA) / 59.27
References / 59.35
Part 14 Environmental Issues
Chapter 60. Process Waste Minimization and Treatment 60.3
60.1 Introduction / 60.3
60.2 Regulatory Compliance / 60.3
60.3 Major Sources and Amounts of Wastewater
in a Printed Circuit Board Fabrication Facility / 60.5
60.4 Waste Minimization / 60.6
60.5 Pollution Prevention Techniques / 60.8
60.6 Recycling and Recovery Techniques / 60.15
60.7 Alternative Treatments / 60.18
60.8 Chemical Treatment Systems / 60.21
60.9 Advantages and Disadvantages of Various Treatment Alternatives / 60.26

Part 15 Flexible Circuits
Chapter 61. Flexible Circuit Applications and Materials 61.3
61.1 Introduction to Flexible Circuits / 61.3
61.2 Applications of Flexible Circuits / 61.6
61.3 High-Density Flexible Circuits / 61.6
61.4 Materials for Flexible Circuits / 61.8
61.5 Substrate Material Properties / 61.9
61.6 Conductor Materials / 61.13
61.7 Copper-Clad Laminates / 61.14
61.8 Coverlay Material / 61.19
61.9 Stiffener Materials / 61.22
61.10 Adhesive materials / 61.22
61.11 Restriction of Hazardous Substances
(RoHS) Issues / 61.23
Chapter 62. Design of Flexible Circuits 62.1
62.1 Introduction / 62.1
62.2 Design Procedure / 62.1
62.3 Types of Flexible Circuits / 62.2
62.4 Circuit Designs for Flexibility / 62.12
62.5 Electrical Design of the Circuits / 62.15
62.6 Circuit Designs for Higher Reliability / 62.16
62.7 Circuit Designs for RoHS Compliance / 62.17
Chapter 63. Manufacturing of Flexible Circuits 63.1
63.1 Introduction / 63.1
63.2 Special Issues with HDI Flexible Circuits / 63.1
63.3 Basic Process Elements / 63.3
63.4 New Processes for Fine Traces / 63.14
63.5 Coverlay Processes / 63.24
63.6 Surface Treatment / 63.30
63.7 Blanking / 63.31
63.8 Stiffener Processes / 63.33
63.9 Packaging / 63.33
63.10 Roll-to-Roll Manufacturing / 63.34
63.11 Dimension Control / 63.36
Chapter 64. Termination of Flexible Circuits 64.1
64.1 Introduction / 64.1
64.2 Selection of Termination Technologies / 64.1
64.3 Permanent Connections / 64.4
64.4 Semipermanent Connections / 64.11
64.5 Nonpermanent Connections / 64.13
64.6 High-Density Flexible Circuit Termination / 64.20
Chapter 65. Multilayer Flex and Rigid/Flex 65.1
65.1 Introduction / 65.1
65.2 Multilayer Rigid/flex / 65.1

Chapter 66. Special Constructions of Flexible Circuits 66.1
66.1 Introduction / 66.1
66.2 Flying-Lead Construction / 66.1
66.3 Tape Automated Bonding / 66.8
66.4 Microbump Arrays / 66.10
66.5 Thick-Film Conductor Flex Circuits / 66.12
66.6 Shielding of the Flexible Cables / 66.13
66.7 Functional Flexible Circuits / 66.14
Chapter 67. Quality Assurance of Flexible Circuits 67.1
67.1 Introduction / 67.1
67.2 Basic Concepts in Flexible Circuit Quality Assurance / 67.1
67.3 Automatic Optical Inspection Systems / 67.2
67.4 Dimensional Measurements / 67.3
67.5 Electrical Tests / 67.3
67.6 Inspection Sequence / 67.3
67.7 Raw Materials / 67.6
67.8 Flexible Circuit Feature Inspection / 67.6
67.9 Standards and Specifications for Flexible Circuits / 67.8
Appendix A.1
Glossary G.1
Index I.1
CONTENTS xix

richyrichy

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no link on book?