前端后端职位亮相简历发boss@hi-talent.net

jj_seu · 发表于 2013-12-11 22:57:03

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1.Senior ASIC Digital Design Engineer

Responsibilities:
l  Responsible for logic design and verification in low-power wireless communications chips.
l  Also responsible for module-level lint checking, timing checking and formal verification.
Qualifications:
l  Proficiency in logic design, simulation, synthesis and testing.
l  Proficiency in Verilog and its simulation environment.
l  Experience with low-power design.
l  Good knowledge of SOC design.
l  Experience in wireless communication or multimedia technologies is a plus.
l  Experience in ARM and AMBA design is a plus.
l  Self-motivated and good team player.
l  MSEE or BSEE with 4+ years.

2.高级芯片后端设计工程师

Job Description
1、参与超大规模SOC芯片物理设计的全流程；
2、挑战实现业界速度最快、功耗最低的高性能SOC芯片；
Qualification
1、本科4年以上相关工作经验（硕士3年以上相关工作经验），并有实际的tapeout经验；
2、熟练掌握深亚微米后端物理设计流程；