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再增加:精通RFIC MMIC封装选型,封装基板电性能设计。能够熟练使用EDA软件开展芯片pcb协同仿真设计。了解封装的热 可靠性 可加工性设计。了解业界封装
射频,无源器件,电磁场分析
职位职能: 射频工程师
集成电路IC设计/应用工程师
职位描述:
职责:
基于硅片上的滤波器、耦合器、巴伦、功率分配器、双工器,以及片上电阻、电容和电感等射频集成无源器件设计、建模、封装、测试。
要求:
精通硅衬底上射频无源器件的集成化、小型化设计;
熟练使用电路分析软件Cadence Virtuoso和ADS,熟练使用电磁场分析软件ADS Momenturm和HFSS;
了解无线通信系统及系统对各无源器件指标要求;
熟练使用探针测试台和矢量网络分析仪进行射频芯片及封装的测试等;
熟悉IPD设计和射频芯片的flipchip和wirebond等封装形式尤佳。
Responsibility:
Design, simulate and characterize on-chip passvie components, including inductors, capacitors, filters, diplexers, and baluns for applications in wireless communication modules and other microelectronics.
Design test-fixtures for passive components at chip and package level measurement with VNA.
Work with IC foundry and packaging companies to carry out passive component design and manufacture.
Requirements:
Be familiar with circuit simulation tools such as Cadence Virtuoso and ADS
Be familiar with electromagnetic simulation tools such as ADS Momentum and HFSS
Knowledge of wireless architecture and design spec for each subsystem
Knowledge of circuit, transmission line and EM theory and RF/microwave design techniques
The experience on the IPD design with wirebond or flipchip packaging will be a plus.
贵司有招聘需求的,欢迎随时和我联系;
Best Regards, Jane.Jin
Principal Consultant & General Manager @ Hi-Talent Consulting Co.,Ltd. 上海芯相会企业管理咨询有限公司 Mob: 15921265928 Skype: ScarlettJaneJin E-Mail: Jane-Jin@Hi-Talent.net QQ: 1687562641 Blog: http://blog.sina.com.cn/u/1716864892 Weibo: http://weibo.com/u/1716864892 Linkedin: jj_seu@hotmail.com
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