求IC版图设计工程师职位（工作地点苏州或昆山）

sujin520

本人毕业于211重点大学，微电子专业，有5年的版图设计工作经验，现在正在找工作，有哪家HR或猎头招聘的话，请帮忙推荐，我的邮箱：13771978979@139.com 十分感谢！

sujin520

怎么就没人帮忙推荐下呢……

sujin520

本人毕业于211重点大学，微电子专业，有5年的版图设计工作经验，现在正在找工作，有哪家HR或猎头招聘的话， ...
sujin520 发表于 2013-5-15 09:11

                               
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工作地点江苏或上海都可以，请大家帮忙介绍下，谢谢。

amd_srdc

不知楼主工作是否已经定好。如果对 GPU（AMD） 的PD感兴趣，可以内部推荐下。

mail : amd_cdc@163.com  QQ：1756384832

JD：
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc. The individual is expected to be an expert in multiple aspects in PD areas and provide technically leadership to the engineering team. The individual is also expected to be accountable for project delivery.
Job Requirement:

1.        5+ years or more years of experience in physical design of deep submicron digital ASIC chips
2.        Hands on experience in large scale ASIC chip physical design
3.        Knowledgeable in all aspects of deep submicron ASIC design flow
4.        Successfully gone through several complete product development cycles
5.        Demonstrate strong leadership and work well with cross-functional teams
6.        Good listening, writing and speaking English
7.        Good communication skills, strong interpersonal skills and the flexibility
8.        Dedicated, hard working and good team player
9.        Familiar with Back-End (physical design) EDA tools
10.        Familiar with Front-End EDA tools is a plus
11.        Familiar with Unix/Linux environment and good at scripts

amd_srdc

不知楼主工作是否已经定好，如果对GPU（AMD）的PD感兴趣的话，可以内部推荐。

mail : amd_cdc@163.com  QQ：1756384832


Job Description:        
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc. The individual is expected to be an expert in multiple aspects in PD areas and provide technically leadership to the engineering team. The individual is also expected to be accountable for project delivery.
Job Requirement:
1.        5+ years or more years of experience in physical design of deep submicron digital ASIC chips
2.        Hands on experience in large scale ASIC chip physical design
3.        Knowledgeable in all aspects of deep submicron ASIC design flow
4.        Successfully gone through several complete product development cycles
5.        Demonstrate strong leadership and work well with cross-functional teams
6.        Good listening, writing and speaking English
7.        Good communication skills, strong interpersonal skills and the flexibility
8.        Dedicated, hard working and good team player
9.        Familiar with Back-End (physical design) EDA tools
10.        Familiar with Front-End EDA tools is a plus
11.        Familiar with Unix/Linux environment and good at scripts

amd_srdc

不知楼主工作是否已经定好，如果对GPU（AMD）的PD感兴趣的话，可以内部推荐。

mail : amd_cdc@163.com  QQ：1756384832


Job Description:        
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc. The individual is expected to be an expert in multiple aspects in PD areas and provide technically leadership to the engineering team. The individual is also expected to be accountable for project delivery.
Job Requirement:
1.        5+ years or more years of experience in physical design of deep submicron digital ASIC chips
2.        Hands on experience in large scale ASIC chip physical design
3.        Knowledgeable in all aspects of deep submicron ASIC design flow
4.        Successfully gone through several complete product development cycles
5.        Demonstrate strong leadership and work well with cross-functional teams
6.        Good listening, writing and speaking English
7.        Good communication skills, strong interpersonal skills and the flexibility
8.        Dedicated, hard working and good team player
9.        Familiar with Back-End (physical design) EDA tools
10.        Familiar with Front-End EDA tools is a plus
11.        Familiar with Unix/Linux environment and good at scripts

amd_srdc

不知楼主工作是否已经定好，如果对GPU（AMD）的PD感兴趣的话，可以内部推荐。

mail : amd_cdc@163.com  QQ：1756384832


Job Description:        
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc. The individual is expected to be an expert in multiple aspects in PD areas and provide technically leadership to the engineering team. The individual is also expected to be accountable for project delivery.
Job Requirement:
1.        5+ years or more years of experience in physical design of deep submicron digital ASIC chips
2.        Hands on experience in large scale ASIC chip physical design
3.        Knowledgeable in all aspects of deep submicron ASIC design flow
4.        Successfully gone through several complete product development cycles
5.        Demonstrate strong leadership and work well with cross-functional teams
6.        Good listening, writing and speaking English
7.        Good communication skills, strong interpersonal skills and the flexibility
8.        Dedicated, hard working and good team player
9.        Familiar with Back-End (physical design) EDA tools
10.        Familiar with Front-End EDA tools is a plus
11.        Familiar with Unix/Linux environment and good at scripts

amd_srdc

不知楼主工作是否已经定好，如果对GPU（AMD）的PD感兴趣的话，可以内部推荐。

mail : amd_cdc@163.com  QQ：1756384832


Job Description:        
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc. The individual is expected to be an expert in multiple aspects in PD areas and provide technically leadership to the engineering team. The individual is also expected to be accountable for project delivery.
Job Requirement:
1.        5+ years or more years of experience in physical design of deep submicron digital ASIC chips
2.        Hands on experience in large scale ASIC chip physical design
3.        Knowledgeable in all aspects of deep submicron ASIC design flow
4.        Successfully gone through several complete product development cycles
5.        Demonstrate strong leadership and work well with cross-functional teams
6.        Good listening, writing and speaking English
7.        Good communication skills, strong interpersonal skills and the flexibility
8.        Dedicated, hard working and good team player
9.        Familiar with Back-End (physical design) EDA tools
10.        Familiar with Front-End EDA tools is a plus
11.        Familiar with Unix/Linux environment and good at scripts