LSI上海急招Package Design Engineer

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有意者，请将简历发至：Tracey.zheng@lsi.com

如有任何疑问，请发送邮件至Tracey.zheng@lsi.com或拨打电话021-24191709.

也可加我msn: zql975504@hotmail.com

或者微博啊：http://www.weibo.com/u/1752448637

1.
Package Design Engineer

Job Description

You will support the design of flip chip substrates, work closely with the LSI customers from design start to tooling completion steps. Work directly with program management, reliability, product engineering groups to align package design and materials necessary to support program schedule, and readiness for customer prototypes and production. Responsible for documentations associated with the substrate design release for tooling with the substrate suppliers as part of the design closure.

Requirements/Qualifications (Education)

3-5 year experience in the design and implementation of multilayer BGA substrate technology for support of single or multi-chip package constructions. Good hands on knowledge of Cadence APD design tool is required. Good communication and written skills required for design engagement with internal engineering teams and external customers. Must be detail oriented in design specifications, implementation, reviews with customers. Background in organic substrate manufacturing processes is desired. Familiarity with the influence of physical design parameters affecting electrical/ thermal performance of packaging technologies desired. Knowledge of flip chip assembly processes. Familiar with electrical and thermal characteristics of packages.
Familiarity and hands on knowledge of Microsoft project, word, excel.
Excellent written and spoken skills in Mandarin and English.

yulingyanyuyu

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