[AMD社招] 最新招聘2012/4/13(上海/北京/苏州,员工内荐)暂不面向应届毕业生

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2012-4-13 22:19 上传

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AMD(超威半导体)HR部门刚刚open的最新职位空缺，特别增加了大量北京site的职位，涵盖了IC芯片前后端设计、验证，软件驱动开发应用，board设计与测试，以及其它相关职能部门。下面列出了职位的简单信息和工作地点，具体职位要求详见附件JD（若无法下载，可直接mail或QQ索要）。
PS：这次招聘只面向社招，只能对今年毕业的童鞋们表示遗憾了。我是AMD员工(非猎头)，已内部推荐多位朋友成功加盟AMD成为同事，比较熟悉各部门应聘和面试流程。有兴趣的同志们可以把简历直接发邮件到我的邮箱 : enjoyasic@126.com，或者QQ细聊 : 2268442346。有任何关于这边面试、公司文化、工作环境、职业发展的问题都欢迎交流，希望能有效提高你应聘的目的性和面试的成功几率。
另，提醒大家的是请大家千万不要一简历多投，这不但不会增加你的成功性，反而会因为极大程度增加HR工作的不可控性和反感，并对你的应聘造成不利影响。

北京site
1. HRBP
2. HRBP
3. Legal Counsel
4.Finance analyst
5.OEM Sales
6.HR PMO lead
7.Staff C&B analyst
8.OSS MTS/Senior system verification engineer
9.ASIC Engineer for Chip Integration (MTS / Sr. Eng)
10.MM Senior DV
11.MM MTS DV
12.Senior PD
13.MTS PD
14.Senior DFT
15.MTS DFT
16.FCH MTS DE
17.FCH Senior DE
18.FCH SMTS DE
19.FCH MTS DV
20.FCH MTS SOC
21.FCH Senior DV
22.FCH Senior SOC
23.FCH SMTS DV
24.FCH SMTS SOC

上海site
1.EAD 2
2.Sr. Sys/​Test Validation Engineer
3.MTS Hardware Development Engineer-GPU/APU
4.MTS - Firmware Engineer-Vedio/ISP/Camera
5.SMTS-Server Silicon Validation Architect
6. ASIC Design Engineer2/ Sr. ASIC Design Engineer
7. ASIC Design Verification / Sr. ASIC Design Verification Engineer
8. MTS ASIC Design Engineer
9. MTS ASIC Design Verification Engineer
10.Silicon Engineering Manager
11.Design Verification Manager for Graphics Hardware
12.Sect. Manager of GFX Design Verification
13.Sr./MTS Design Verification Engineer for Graphics Hardware
14.Sr./MTS Engineer of GFX Design Verification
15.GPU Computer Architect(Performance Verification)
16.Sr./MTS GPU Integration Engineer
17.Sr. ASIC CAD Engineer - Timing
18.Sr. ASIC CAD Engineer – FCFP/TDFP
19.Sr./MTS Physical Design Engineer
20.Sr. Design Engineer of GPU IP
21.Program Manager for SW
22.MTS/Sr. Linux  Base Driver
23.MTS/Sr. BIOS
24.MTS/Sr. Open GL
25.MTS/Sr. Windows D3D
26.MTS/Sr. Linux Southbridge Driver
27.MTS/Sr. of Application software engineer
28.MTS/Sr. Windows 2d Graphic Driver
29.MTS/Sr. Windows Southbridge Driver

苏州site
1.Facility Section Manager
2.MTS Product Development Eng.
3.Sr. Product Development Engineer
4.Sr. Packaging Engineer ( Flipchip )
5.SLT Yield  Engineer
6.Packaging Engineer   ( Assembly)
7.Logistics Specialist ( SAP Super User )
8.Process Engineer (CIP)
9.Process Engineer (Assembly)

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