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本帖最后由 calabazas 于 2010-12-10 09:31 编辑
[文集] Signal Integrity Characterization Techniques 2009
求人不如求己,拼凑集种,就差第17章的5页 (569,571,574,575,578) ,有劳有心的朋友帮忙补齐
[Description]
Signal Integrity Characterization Techniques addresses the gap between traditional digital and microwave measurement technologies while focusing on a practical and intuitive understanding of signal integrity effects within the data transmission channel. High-speed interconnects such as connectors,
PCBs, cables, IC packages, and backplanes are critical elements of differential channels that must now be optimized using today’s most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test and must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements—from backplane design challenges to advanced error correction techniques to jitter measurement tools. The authors’ approach wisely address many of today’s high-speed technologies, provides excellent insight into its future direction, and will teach the reader valuable lessons pertaining to the signal integrity industry.
ABOUT THE AUTHORS
Mike Resso is a signal integrity application specialist in the component test division of Agilent Technologies. He is responsible for the technical training of field engineers, symposium lecturing, and the creation of sales tools that will expand the worldwide market growth of high bandwidth oscilloscopes. His current activities include developing novel signal integrity measurement techniques related to high-speed digital design applications, identifying new test methodologies in the communications field, and interfacing with Agilent R&D engineers to bring innovative products to the marketplace. He has over twenty years experience in the test and measurement industry, and his background includes the design and development of electro-optic test instrumentation for aerospace and commercial applications. His most recent activity has focused on the complete multiport characterization of high speed digital interconnects using time domain reflectometry and vector network analysis. He has authored over 20 technical papers in diverse fields such as infrared detector probe systems, linearly variable optical filters, and electrically conductive antireflection coatings. Mike received a B.S. degree in electrical and computer engineering from University of California.
Eric Bogatin is signal integrity evangelist of Bogatin Enterprises, LLC which specializes in training for signal integrity and interconnect design. His company offers a complete curriculum in short courses and training materials to help accelerate engineers and managers up the learning curve to be more effective in fields related to signal integrity. He has held senior engineering and management positions at such companies as AT&T Bell Labs, Raychem Corporation, Advanced Packaging Systems, and Sun Microsystems. For 20 years, he has been involved in various aspects of signal integrity and inter-connect design, from the materials side, manufacturing, product design, measurements and, most recently, education and consulting. Eric has written four books on signal integrity and inter-connect design, over 200 papers, and most recently wrote a book entitled Signal Integrity-Simplified published in 2004. Eric received his Ph.D. in physics from the University of Arizona in Tucson in 1980 and his B.S. in physics from the Massachusetts Institute of Technology in 1976.
[Contents]
Part I: Getting Started – Introducing TDR and VNA Techniques and the Power of S-Parameters
Chapter 1: Signal-Port TDR, TDR/TDT, and Two-Port TDR: Interconnect Analysis is Simplified with Physical Layer Tools
Eric Bogatin, President, Bogatin Enterprises
Mike Resso, Signal Integrity Applications Scientist, Component Test Division, Agilent Technologies
Chapter 2: 4-Port TDR/VNA/PLTS – Interconnect Analysis Is Simplified with Physical Layer Test Tools
Eric Bogatin, President, Bogatin Enterprises
Mike Resso, Signal Integrity Applications Scientist, Component Test Division, Agilent Technologies
Chapter 3: Differential Impedance Design and Verification with Time Domain Reflectometry
Eric Bogatin, President, Bogatin Enterprises
Mike Resso, Product Manager, Lightwave Division, Agilent Technologies
Chapter 4: Utilizing TDR and VNA Data to Develop Four-Port Frequency-Dependent Models
Jim Mayrand, Signal Integrity Consultant
Mike Resso, Product Manager, Signal Integrity Operation, Agilent Technologies
Dima Smolyansky, TDA Systems
Chapter 5: Accuracies and Limitations of Time and Frequency Domain Analyses of Physical-Layer Devices
Robert Schaefer, Technical Leader and R&D Project Manager, Signal Integrity Group, Agilent Technologies
Chapter 6: Data Mining 12-Port S-Parameters
Eric Bogatin, President, Bogatin Enterprises
Mike Resso, Signal Integrity Application Scientist, Component Test Division, Agilent Technologies
Part II: Backplane Measurements and Analysis
Chapter 7: A Design of Experiments for Gigabit Serial Backplane Channels
Jack Carrel, System IO Specialist,
Xilinx
Bill Dempsey, Owner and President, Redwire Enterprises
Mike Resso, Signal Integrity Application Scientist, Component Test Division, Agilent Technologies
Chapter 8: Gigabit Backplane Design, Simulation, and Measurement: The Unabridged Story
Edward Sayre, Owner and Director, NESA
Jinhua Chen, Signal Integrity and EMI Engineer, NESA
Michael Baxter, Signal Integrity Engineer, NESA
Gautam Patel, Signal Integrity Engineer, New Product Development, Teradyne
John Goldie, Member of the Technical Staff, National Semiconductor
Mike Resso, Product Manager, Lightwave Division, Agilent Technologies
Part III: Assuring Quality Measurements = Probing and De-Embedding
Chapter 9: The ABCs of De-Embedding
Eric Bogatin, President, Bogatin Enterprises
Mike Resso, Signal Integrity Applications Scientist, Component Test Division, Agilent Technologies
Chapter 10: Backplane Differential Channel Microprobe Characterization in Time and Frequency Domains
Eric Bogatin, Chief Technologial Officer, GigaTest Labs
Mike Resso, Signal Integrity Operation, Agilent Technologies
Chapter 11: Differential PCB Structures Using Measured TRL Calibration and Simulated Structure De-Embedding
Heidi Barnes, High-Frequency Device Interface Board Designer, Verigy, Inc.
Antonio Ciccomancini, Application Engineer, CST of America, Inc.
Mike Resso, Signal Integrity Applications Scientist, Component Test Division, Agilent Technologies
Ming Tsai, Staff Hardware Development Engineer, Production Technology Division, Xilinx
Chapter 12: Validating Transceiver
FPGAs Using Advanced Calibration Techniques
Mike Resso, Business Development Manager, Signal Integrity Applications, Agilent Technologies
Hong Shi, Member of Technical Staff, Packing Technology,
Altera
Chapter 13: Performance at the DUT: Techniques for Evaluating the Performance of an ATE System at the DUT Socket
Heidi Barnes, Senior Application Consultant, Verigy
José Moreira, Senior Application Consultant, Verigy
Michael Comai, Senior Product Engineer, AMD
Abraham Islas, Senior Product Engineer, AMD
Francisco Tamayo-Broes, Product Development Engineer, AMD
Mike Resso, Signal Integrity Measurement Specialist, Component Test Division, Agilent Technologies
Antonio Ciccomancini, Application Engineer, CST
Orlando Bell, Vice President, Engineering, GigaTest Labs
Ming Tsai, Principal Engineer, RF Design Group, Amalfi Semiconductor
Chapter 14: Frequency Domain Calibration: A Practical Approach for the Serial Data Designer
Steven Corey, Principal Engineer, Electro-Optical Product Line, Tektronix
Eric Bogatin, President, Bogatin Enterprises
Dima Smolyansky, Product Marketing Manager, Tektronix
Chapter 15: Practical Design and Implementation of Stripline TRL Calibration Fixtures for 10-Gigabit Interconnect Analysis
Vince Duperron, Design Engineer, Molex
Dave Dunham, Electrical Engineer Manager, Molex
Mike Resso, Product Manager, Signal Integrity Applications, Agilent Technolgies
Part IV: Jitter and Active Signal Analysis
Chapter 16: Channel Compliance Testing Utilizing Novel Statistical Eye Methodology
Anthony Sanders, Principal Engineer, Infineon
Mike Resso, Product Manager, Agilent Technologies
John D’Ambrosia, Manager, Semiconductor Relations, Tyco Electronics
Chapter 17: Characterizing Jitter Performance on High-Speed Digital Devices Using Innovative Sampling Technology
Osvaldo Buccafusca, Development Scientist, Lightwave Division, Agilent Technologies
Mike Resso, Product Manager, Agilent Technologies
Chapter 18: Signal Integrity Concerns When Modulating Laser Transmitters at Gigabit Rates
Stephen Reddy, Senior Design Engineer, Transmission Subsystems Group, JDS Uniphase
Laurie Taira, Senior Product Engineer, Research and Development, Delphi Connection Systems
Mike Resso, Product Manager, Lightwave Division, Agilent Technologies
Part V: Analysis of New Technologies
Chapter 19: The Role of Dielectric Constant and Dissipation Factor Measurements in Multi-Gigabit Systems
Eric Bogatin, President, Bogatin Enterprises
Shelley Begley, Team Leader, Agilent Technologies
Mike Resso, Signal Integrity Applications Scientist, Component Test Division, Agilent Technologies
Chapter 20: Designing Scalable 10G Backplane Interconnect Systems Utilizing Advanced Verification Methodologies
Kevin Grundy, Chief Executive Officer, SiliconPipe
Haw-Jyh Liaw, Director, Systems Engineering, Aeluros
Gary Otonari, Engineering Project Manager, GigaTest Labs
Mike Resso, Business Development Manager, Signal Integrity Operation, Agilent Technologies
Chapter 21: Investigating Microvia Technology for 10 Gbps and Higher Telecommunications Systems
Mike Resso, Business Development Manager, Signal Integrity Applications, Agilent Technologies
Thomas Gneiting, Founder, AdMOS Advanced Modeling
Roland Mödinger, Senior Engineer, ERNI Electroapparate GmbH
Jason Roe, Application Engineer, ERNI Electroapparate GmbH
Chapter 22: ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials
Heidi Barnes, Senior Application Consultant, Verigy
José Moreira, Senior Application Consultant, Verigy
Tom McCarthy, Vice President, Taconic
William Burns, Senior Applications Engineer, Altanova Corporation
Crescencio Gutierrez, Engineering and Research and Development Manager, Harbor Electronics
Mike Resso, Signal Integrity Measurement Specialist, Agilent Technologies
Part VI: Future Directions
Chapter 23: Design and Test Challenges Facing Next-Generation 20 Gbps Interconnects
Jay Diepenbrock, Senior Technical Staff Member, Interconnect Qualification Engineering, IBM
Will Miller, Vice President, Engineering, Efficere Technologies
Mike Resso, Signal Integrity Applications Scientist, Component Test Division, Agilent Technologies
Author Biographies
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